公开(公告)号：US11581289B2

公开(公告)日：2023-02-14

申请号：US16935081

申请日：2020-07-21

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Yong Chen ,  David Gani

IPC: H01L25/065 ,  H01L21/56 ,  H01L25/16 ,  H01L23/13 ,  H01L23/498 ,  H01L23/00

Abstract: A multi-chip package including a first integrated circuit and a second integrated circuit. The first integrated circuit includes a first side having a first conductive layer, a second side having a second conductive layer, and an edge, the first conductive layer coupled to the second conductive layer at a location adjacent to the edge. The second integrated circuit is coupled to the second conductive layer of the first integrated circuit.

公开(公告)号：US12136608B2

公开(公告)日：2024-11-05

申请号：US18166931

申请日：2023-02-09

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Yong Chen ,  David Gani

IPC: H01L25/065 ,  H01L21/56 ,  H01L23/00 ,  H01L23/13 ,  H01L23/498 ,  H01L25/16

Abstract: A multi-chip package including a first integrated circuit and a second integrated circuit. The first integrated circuit includes a first side having a first conductive layer, a second side having a second conductive layer, and an edge, the first conductive layer coupled to the second conductive layer at a location adjacent to the edge. The second integrated circuit is coupled to the second conductive layer of the first integrated circuit.

公开(公告)号：US11270946B2

公开(公告)日：2022-03-08

申请号：US16987002

申请日：2020-08-06

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Yong Chen ,  David Gani

IPC: H01L23/538 ,  H01L25/065 ,  H01L23/00

Abstract: The present disclosure is directed to a package that includes openings that extend into the package. The openings are filled with a conductive material to electrically couple a first die in the package to a second die in the package. The conductive material that fills the openings forms electrical interconnection bridges between the first die and the second die. The openings in the package may be formed using a laser and a non-doped molding compound, a doped molding compound, or a combination of doped or non-doped molding compounds.