Invention Grant
- Patent Title: Package with overhang inductor
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Application No.: US16998666Application Date: 2020-08-20
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Publication No.: US11270986B2Publication Date: 2022-03-08
- Inventor: Ahmadreza Odabaee , John David Brazzle , Zafer Kutlu , Zhengyang Liu , George Anthony Serpa
- Applicant: Analog Devices, Inc.
- Applicant Address: US MA Norwood
- Assignee: Analog Devices, Inc.
- Current Assignee: Analog Devices, Inc.
- Current Assignee Address: US MA Norwood
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H01L25/16
- IPC: H01L25/16 ; H01F27/28 ; H02M3/04 ; H01L23/00
Abstract:
This disclosure describes techniques to provide a regulator circuit using a component-on-top (CoP) package. The CoP package comprising a system-in-package (SIP) comprising regulator circuitry, the SIP having a top portion and a first side portion; and an inductor on the top portion of the SIP, wherein: the inductor is coupled to the regulator circuitry via the top portion of the SIP; and a first end of the inductor extends beyond the first side portion of the SIP.
Public/Granted literature
- US20210358895A1 PACKAGE WITH OVERHANG INDUCTOR Public/Granted day:2021-11-18
Information query
IPC分类:
