公开(公告)号：US11270986B2

公开(公告)日：2022-03-08

申请号：US16998666

申请日：2020-08-20

Applicant: Analog Devices, Inc.

Inventor： Ahmadreza Odabaee ,  John David Brazzle ,  Zafer Kutlu ,  Zhengyang Liu ,  George Anthony Serpa

IPC: H01L25/16 ,  H01F27/28 ,  H02M3/04 ,  H01L23/00

Abstract: This disclosure describes techniques to provide a regulator circuit using a component-on-top (CoP) package. The CoP package comprising a system-in-package (SIP) comprising regulator circuitry, the SIP having a top portion and a first side portion; and an inductor on the top portion of the SIP, wherein: the inductor is coupled to the regulator circuitry via the top portion of the SIP; and a first end of the inductor extends beyond the first side portion of the SIP.

公开(公告)号：US20210358895A1

公开(公告)日：2021-11-18

申请号：US16998666

申请日：2020-08-20

Applicant: Analog Devices, Inc.

Inventor： Ahmadreza Odabaee ,  John David Brazzle ,  Zafer Kutlu ,  Zhengyang Liu ,  George Anthony Serpa

IPC: H01L25/16 ,  H01F27/28 ,  H02M3/04 ,  H01L23/00

Abstract: This disclosure describes techniques to provide a regulator circuit using a component-on-top (CoP) package. The CoP package comprising a system-in-package (SIP) comprising regulator circuitry, the SIP having a top portion and a first side portion; and an inductor on the top portion of the SIP, wherein: the inductor is coupled to the regulator circuitry via the top portion of the SIP; and a first end of the inductor extends beyond the first side portion of the SIP.