公开(公告)号：US20210358895A1

公开(公告)日：2021-11-18

申请号：US16998666

申请日：2020-08-20

Applicant: Analog Devices, Inc.

Inventor： Ahmadreza Odabaee ,  John David Brazzle ,  Zafer Kutlu ,  Zhengyang Liu ,  George Anthony Serpa

IPC: H01L25/16 ,  H01F27/28 ,  H02M3/04 ,  H01L23/00

Abstract: This disclosure describes techniques to provide a regulator circuit using a component-on-top (CoP) package. The CoP package comprising a system-in-package (SIP) comprising regulator circuitry, the SIP having a top portion and a first side portion; and an inductor on the top portion of the SIP, wherein: the inductor is coupled to the regulator circuitry via the top portion of the SIP; and a first end of the inductor extends beyond the first side portion of the SIP.

公开(公告)号：US20230335328A1

公开(公告)日：2023-10-19

申请号：US17723260

申请日：2022-04-18

Applicant: Analog Devices, Inc.

Inventor： Steve Hawley ,  George Anthony Serpa ,  John David Brazzle ,  Jim Yang

IPC: H01F27/26 ,  H01F41/02

CPC classification number: H01F27/26 ,  H01F41/0206

Abstract: A low-profile coupled inductor is disclosed to provide compact and high performance magnetic coupling. The low-profile coupled inductor has an asymmetrical geometry, having a pair of complementary ferrite cores supporting a pair of conducting strips in an alternating serpentine pattern. One or more core gaps exist between the cores to create a strong flux coupling between adjacent magnetic fields of either conducting strip. The alternating serpentine conductors and core gaps serve to increase energy transfer between the magnetic fields and improve the overall power density of the low-profile coupled inductor.

公开(公告)号：US11270986B2

公开(公告)日：2022-03-08

申请号：US16998666

申请日：2020-08-20

Applicant: Analog Devices, Inc.

Inventor： Ahmadreza Odabaee ,  John David Brazzle ,  Zafer Kutlu ,  Zhengyang Liu ,  George Anthony Serpa

IPC: H01L25/16 ,  H01F27/28 ,  H02M3/04 ,  H01L23/00

Abstract: This disclosure describes techniques to provide a regulator circuit using a component-on-top (CoP) package. The CoP package comprising a system-in-package (SIP) comprising regulator circuitry, the SIP having a top portion and a first side portion; and an inductor on the top portion of the SIP, wherein: the inductor is coupled to the regulator circuitry via the top portion of the SIP; and a first end of the inductor extends beyond the first side portion of the SIP.