Invention Grant
- Patent Title: Housing with pressure compensating element
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Application No.: US16767522Application Date: 2018-11-30
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Publication No.: US11274986B2Publication Date: 2022-03-15
- Inventor: Benjamin Bohl , Daniel Mietke
- Applicant: TDK Electronics AG
- Applicant Address: DE Munich
- Assignee: TDK Electronics AG
- Current Assignee: TDK Electronics AG
- Current Assignee Address: DE Munich
- Agency: Slater Matsil, LLP
- Priority: DE102017128460.5 20171130
- International Application: PCT/EP2018/083193 WO 20181130
- International Announcement: WO2019/106169 WO 20190606
- Main IPC: G01L19/14
- IPC: G01L19/14 ; G01L19/06

Abstract:
A housing is disclosed. In an embodiment a housing includes a housing opening, a pressure-compensating element mounted on an inner side of the housing opening, a protective wall mounted on an outer side of the housing opening surrounding the housing opening and a bridge arranged over the outer side of the housing opening and protruding beyond the housing opening, wherein the bridge is shaped and arranged such that a projection of the bridge at least partially covers the housing opening.
Public/Granted literature
- US20200370985A1 Housing Public/Granted day:2020-11-26
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