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公开(公告)号：US11561146B2
公开(公告)日：2023-01-24
申请号：US16762079
申请日：2018-11-07
Applicant: TDK Electronics AG
Inventor： Christian Wohlgemuth , Benjamin Bohl
Abstract: In an embodiment, a pressure sensor system includes a pressure sensor element with a flexible plate, wherein the pressure sensor element is a piezoresistive sensor element and a support element on which the pressure sensor element is arranged, wherein a flow channel configured to supply a medium to the flexible plate runs in the support element, wherein the flow channel has at least one sub-section, a longitudinal direction of which running perpendicularly below the flexible plate, and wherein a channel cross section of the at least one sub-section of the flow channel is at no point within the sub-section of the flow channel smaller than an area of the flexible plate.
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公开(公告)号：US20200340874A1
公开(公告)日：2020-10-29
申请号：US16762079
申请日：2018-11-07
Applicant: TDK Electronics AG
Inventor： Christian Wohlgemuth , Benjamin Bohl
Abstract: A pressure sensor system is disclosed. In an embodiment, a pressure sensor system includes a pressure sensor element with a flexible plate, wherein the pressure sensor element is a piezoresistive sensor element and a support element on which the pressure sensor element is arranged, wherein a flow channel configured to supply a medium to the flexible plate runs in the support element, wherein the flow channel has at least one sub-section, a longitudinal direction of which running perpendicularly below the flexible plate, and wherein a channel cross section of the at least one sub-section of the flow channel is at no point within the sub-section of the flow channel smaller than an area of the flexible plate.
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公开(公告)号：US20200292401A1
公开(公告)日：2020-09-17
申请号：US16650937
申请日：2018-09-27
Applicant: TDK Electronics AG
Inventor： Benjamin Bohl , Jan Ihle , Bert Hundertmark , Bernd Polder , Christian Wohlgemuth
Abstract: A pressure sensor is disclosed. In an embodiment a pressure sensor includes a housing comprising a housing wall, a sensor element arranged inside the housing, a ceramic substrate acting as a carrier of the sensor element and of its electrical connection arranged inside the housing and a first heating element arranged inside the housing or the housing wall.
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公开(公告)号：US20200271534A1
公开(公告)日：2020-08-27
申请号：US16650324
申请日：2018-09-27
Applicant: TDK Electronics AG
Inventor： Benjamin Bohl , Jan Ihle , Bert Hundertmark , Bernd Polder , Christian Wohlgemuth
Abstract: A pressure transmitter is disclosed. In an embodiment a pressure transmitter includes a housing including a housing wall, a sensor element arranged inside the housing, a ceramic substrate acting as a carrier of the sensor element and of its electrical connection arranged inside the housing and a first heating element arranged inside the housing or the housing wall, wherein the pressure transmitter is configured to determine differential, relative or absolute pressure.
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Patent Agency Ranking
公开(公告)号：US20200256751A1
公开(公告)日：2020-08-13
申请号：US16629663
申请日：2018-09-27
Applicant: TDK Electronics AG
Inventor： Benjamin Bohl , Jan Ihle , Bert Hundertmark , Bernd Polder , Christian Wohlgemuth
Abstract: A pressure sensor is disclosed. In an embodiment a pressure sensor includes a housing having a housing wall, a sensor element arranged in the housing, a ceramic substrate configured to serve as a support for the sensor element and an electrical connection thereof and a first heating element arranged in an interior of the housing or in the housing wall.
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公开(公告)号：US20250155305A1
公开(公告)日：2025-05-15
申请号：US18839674
申请日：2023-02-08
Applicant: TDK Electronics AG
Inventor： Markus Eberstein , Thomas Stendel , Benjamin Bohl
Abstract: In an embodiment a pressure sensor arrangement includes a sensor element having a top side and a bottom side, wherein the sensor element comprises a membrane configured to be exposed to a medium and at least one detection element configured to measure a pressure of the medium, a substrate serving as a carrier of the sensor element, wherein the substrate comprises glass and a connection interface, produced by laser welding, arranged between the sensor element and the substrate, wherein the sensor element and the substrate are mechanically firmly and hermetically connected to one another at the connection interface.
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公开(公告)号：US11274986B2
公开(公告)日：2022-03-15
申请号：US16767522
申请日：2018-11-30
Applicant: TDK Electronics AG
Inventor： Benjamin Bohl , Daniel Mietke
Abstract: A housing is disclosed. In an embodiment a housing includes a housing opening, a pressure-compensating element mounted on an inner side of the housing opening, a protective wall mounted on an outer side of the housing opening surrounding the housing opening and a bridge arranged over the outer side of the housing opening and protruding beyond the housing opening, wherein the bridge is shaped and arranged such that a projection of the bridge at least partially covers the housing opening.
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公开(公告)号：US11085844B2
公开(公告)日：2021-08-10
申请号：US16650324
申请日：2018-09-27
Applicant: TDK Electronics AG
Inventor： Benjamin Bohl , Jan Ihle , Bert Hundertmark , Bernd Polder , Christian Wohlgemuth
Abstract: A pressure transmitter is disclosed. In an embodiment a pressure transmitter includes a housing including a housing wall, a sensor element arranged inside the housing, a ceramic substrate acting as a carrier of the sensor element and of its electrical connection arranged inside the housing and a first heating element arranged inside the housing or the housing wall, wherein the pressure transmitter is configured to determine differential, relative or absolute pressure.
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公开(公告)号：US20200370985A1
公开(公告)日：2020-11-26
申请号：US16767522
申请日：2018-11-30
Applicant: TDK Electronics AG
Inventor： Benjamin Bohl , Daniel Mietke
Abstract: A housing is disclosed. In an embodiment a housing includes a housing opening, a pressure-compensating element mounted on an inner side of the housing opening, a protective wall mounted on an outer side of the housing opening surrounding the housing opening and a bridge arranged over the outer side of the housing opening and protruding beyond the housing opening, wherein the bridge is shaped and arranged such that a projection of the bridge at least partially covers the housing opening.
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