Invention Grant
- Patent Title: Electronic module
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Application No.: US16614316Application Date: 2017-05-19
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Publication No.: US11276663B2Publication Date: 2022-03-15
- Inventor: Kosuke Ikeda , Osamu Matsuzaki
- Applicant: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Current Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Ladas & Parry, LLP
- International Application: PCT/JP2017/018829 WO 20170519
- International Announcement: WO2018/211685 WO 20181122
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/492 ; H01L23/495 ; H01L25/07 ; H01L23/367 ; H01L23/538

Abstract:
An electronic module has a first substrate 11, a first conductor layer 12 that is provided on one side of the first substrate 11, a first electronic element 13 that is provided on one side of the first conductor layer 12, a second electronic element 23 that is provided on one side of the first electronic element 23, and a second connecting body 70 that has a second head part 71 provided on one side of the second electronic element 23 and an extending part 75 extending from the second head part 71 to the other side and abutting against the first substrate 11 or the first conductor layer 12.
Public/Granted literature
- US20200161270A1 ELECTRONIC MODULE Public/Granted day:2020-05-21
Information query
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