Invention Grant
- Patent Title: Embedded bonded assembly and method for making the same
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Application No.: US16552089Application Date: 2019-08-27
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Publication No.: US11276705B2Publication Date: 2022-03-15
- Inventor: Chen Wu , Peter Rabkin , Yangyin Chen , Masaaki Higashitani
- Applicant: SANDISK TECHNOLOGIES LLC
- Applicant Address: US TX Addison
- Assignee: SANDISK TECHNOLOGIES LLC
- Current Assignee: SANDISK TECHNOLOGIES LLC
- Current Assignee Address: US TX Addison
- Agency: The Marbury Law Group PLLC
- Main IPC: H01L27/1158
- IPC: H01L27/1158 ; H01L27/11573 ; H01L27/11565 ; H01L27/1157 ; H01L27/11524 ; H01L27/11514 ; H01L27/11519 ; H01L27/11553 ; H01L27/11504 ; H01L27/11507 ; H01L27/11529
Abstract:
A semiconductor structure includes a first semiconductor die containing a recesses, and a second semiconductor die which is embedded in the recess in the first semiconductor die and is bonded to the first semiconductor die.
Public/Granted literature
- US20210066317A1 EMBEDDED BONDED ASSEMBLY AND METHOD FOR MAKING THE SAME Public/Granted day:2021-03-04
Information query
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