Invention Grant
- Patent Title: Light-emitting device manufacturing method including filling conductive material in groove structure formed by irradiating with laser light
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Application No.: US16581627Application Date: 2019-09-24
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Publication No.: US11276807B2Publication Date: 2022-03-15
- Inventor: Rie Maeda , Masaaki Katsumata
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan
- Agency: Mori & Ward, LLP
- Priority: JPJP2018-179258 20180925
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01L25/075 ; H01L33/56 ; H01L33/36 ; G02F1/13357

Abstract:
A light-emitting device manufacturing method including providing a light-emitting structure including one or more light-emitting elements and a covering member covering the light-emitting elements. Each of the light-emitting elements have first and second electrodes. The light-emitting structure has a first surface and a second surface opposite to the first surface, and lower surfaces of the first and second electrodes of each light-emitting element are closer to the first surface than the second surface. The method further includes forming a groove structure on the first surface side by irradiation with laser light such that at least part of the first and second electrodes are exposed to an inside of the groove structure, and forming a plurality of wirings inside of the groove structure.
Public/Granted literature
- US20200098963A1 LIGHT-EMITTING DEVICE MANUFACTURING METHOD AND LIGHT-EMITTING DEVICE Public/Granted day:2020-03-26
Information query
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