公开(公告)号：US11026335B2

公开(公告)日：2021-06-01

申请号：US16553086

申请日：2019-08-27

Applicant: NICHIA CORPORATION

Inventor： Rie Maeda ,  Masaaki Katsumata

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/38 ,  H05K3/12 ,  H05K3/40 ,  H05K1/11

Abstract: A wiring board manufacturing method includes: forming a first groove structure in a first principal surface of a base by scanning with laser light in a first irradiation pattern such that the first groove structure has a first width; irradiating an inside of the first groove structure with laser light in a second irradiation pattern that is different from the first irradiation pattern to form recessed portions inside the first groove structure; and forming a first wiring pattern by filling the first groove structure with a first electrically-conductive material to form a first wiring pattern whose shape matches with a shape of the first groove structure in a top view.

公开(公告)号：US10693045B2

公开(公告)日：2020-06-23

申请号：US16037763

申请日：2018-07-17

Applicant: NICHIA CORPORATION

Inventor： Rie Maeda

IPC: H01L33/50 ,  H01L33/54 ,  H01L33/62 ,  H01L33/00 ,  H01L33/60 ,  H01L25/075

Abstract: The method of manufacturing a light emitting device includes: providing a light-transmissive member having a plate-like shape; providing light emitting elements each having a primary light emission surface and an electrode formation surface; bonding the light emitting elements to a base member such that the electrode formation surfaces of the light emitting elements face an upper surface of the base member; disposing the light emitting elements on the light-transmissive member such that the primary light emission surfaces of the light emitting elements face an upper surface of the light-transmissive member via a light-transmissive bonding member; disposing a part of the bonding member on a lateral surface of each of the light emitting elements; removing a part of the light-transmissive member to form a groove between the light emitting elements; forming a light-reflective member at least in the groove; and cutting the light-reflective member and the base member.

公开(公告)号：US11652198B2

公开(公告)日：2023-05-16

申请号：US17589896

申请日：2022-02-01

Applicant: NICHIA CORPORATION

Inventor： Rie Maeda ,  Masaaki Katsumata

IPC: H01L33/62 ,  H01L25/075 ,  H01L33/56 ,  H01L33/36 ,  G02F1/13357

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L33/36 ,  H01L33/56 ,  G02F1/133603 ,  H01L2933/0016 ,  H01L2933/0066

Abstract: A light-emitting device including a light-emitting module, a first wiring and a second wiring. The light-emitting module includes one or more light-emitting elements and a package covering the one or more light-emitting elements. Each of the one or more light-emitting elements has a first electrode and a second electrode. The light-emitting module has a groove structure on a lower surface side. The first wiring and the second wiring are partially or entirely present in the groove structure. At least part of the first electrode and at least part of the second electrode are exposed to an inside of the groove structure. The first wiring is electrically connected with the first electrode, and the second wiring is electrically connected with the second electrode.

公开(公告)号：US11424395B2

公开(公告)日：2022-08-23

申请号：US17008641

申请日：2020-09-01

Applicant: NICHIA CORPORATION

Inventor： Rie Maeda ,  Masaaki Katsumata

IPC: H01L33/56 ,  H01L33/00 ,  H01L33/62

Abstract: A method of manufacturing a light emitting device including: forming grooves by removing a portion of a first resin of a first light emitting structure including a first light emitting element and the first resin, a portion of a second resin of a second light emitting structure including a second light emitting element and the second resin, and a portion of a third resin of a circuit element including a conducting part covered by the third resin, thereby forming a first groove straddling the first resin and the third resin, a second groove straddling the second resin and the third resin, and a third groove extending between the first groove and the second groove; supplying a first conducting material in the first grove and the second groove thereby forming first wiring; and supplying a second conducting material in the third groove thereby forming second wiring.

公开(公告)号：US10757818B2

公开(公告)日：2020-08-25

申请号：US16553086

申请日：2019-08-27

Applicant: NICHIA CORPORATION

Inventor： Rie Maeda ,  Masaaki Katsumata

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/38 ,  H05K3/12 ,  H05K3/40 ,  H05K1/11

Abstract: A wiring board manufacturing method includes: forming a first groove structure in a first principal surface of a base by scanning with laser light in a first irradiation pattern such that the first groove structure has a first width; irradiating an inside of the first groove structure with laser light in a second irradiation pattern that is different from the first irradiation pattern to form recessed portions inside the first groove structure; and forming a first wiring pattern by filling the first groove structure with a first electrically-conductive material to form a first wiring pattern whose shape matches with a shape of the first groove structure in a top view.

公开(公告)号：US12087890B2

公开(公告)日：2024-09-10

申请号：US17565443

申请日：2021-12-29

Applicant: NICHIA CORPORATION

Inventor： Rie Maeda

IPC: H01L33/50 ,  H01L25/075 ,  H01L33/00 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L33/505 ,  H01L33/0095 ,  H01L33/502 ,  H01L33/54 ,  H01L33/62 ,  H01L25/0753 ,  H01L33/60 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2933/0091

Abstract: A light emitting device includes a light emitting element, a light-transmissive member, a bonding member and a light-reflective member. The bonding member is disposed between the light emitting element and the light-transmissive member, with the bonding member covering an upper surface of the light emitting element and at least a part of a lateral surface of the light emitting element. The light-reflective member covers the bonding member and a lateral surface of the light-transmissive member. The bonding member includes a surface that is flush with the lateral surface of the light-transmissive member, and an inclined surface that is inclined so as to extend toward the light-transmissive member.

公开(公告)号：US11245057B2

公开(公告)日：2022-02-08

申请号：US16878241

申请日：2020-05-19

Applicant: NICHIA CORPORATION

Inventor： Rie Maeda

IPC: H01L33/50 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L33/00 ,  H01L25/075

Abstract: The method of manufacturing a light emitting device includes: providing a light-transmissive member; providing light emitting elements each having a primary light emission surface and an electrode formation surface; bonding the light emitting elements to a base member such that the electrode formation surfaces face an upper surface of the base member; disposing a generally flat layer of a light-transmissive bonding member on an upper surface of the light-transmissive member; disposing the light emitting elements on the light-transmissive member such that the primary light emission surfaces face the upper surface of the light-transmissive member via the bonding member; disposing a part of the bonding member on a lateral surface of each of the light emitting elements; removing a part of the light-transmissive member to form a groove between the light emitting elements; forming a light-reflective member at least in the groove; and cutting the light-reflective member.

公开(公告)号：US11894498B2

公开(公告)日：2024-02-06

申请号：US17863393

申请日：2022-07-13

Applicant: NICHIA CORPORATION

Inventor： Rie Maeda ,  Masaaki Katsumata

IPC: H01L33/56 ,  H01L33/00 ,  H01L33/62

CPC classification number: H01L33/56 ,  H01L33/0095 ,  H01L33/62

Abstract: A light emitting device including a first light emitting element that includes a first electrode having a first polarity and a second electrode having a second polarity that is different from the first polarity. The device has a circuit element that includes a main body, and first and second terminals electrically connected with one another via the main body. The device includes a first wiring having the first polarity connecting the first electrode of the first light emitting element and the first terminal, and a second wiring having the second polarity located in a layer common with a layer of the first wiring and including a portion elongated between the first terminal and the second terminal in a bottom view. An upper surface of the main body is positioned at a distance below an interface between a lower surface of the first wiring and the first electrode.

公开(公告)号：US11276807B2

公开(公告)日：2022-03-15

申请号：US16581627

申请日：2019-09-24

Applicant: NICHIA CORPORATION

Inventor： Rie Maeda ,  Masaaki Katsumata

IPC: H01L33/62 ,  H01L25/075 ,  H01L33/56 ,  H01L33/36 ,  G02F1/13357

Abstract: A light-emitting device manufacturing method including providing a light-emitting structure including one or more light-emitting elements and a covering member covering the light-emitting elements. Each of the light-emitting elements have first and second electrodes. The light-emitting structure has a first surface and a second surface opposite to the first surface, and lower surfaces of the first and second electrodes of each light-emitting element are closer to the first surface than the second surface. The method further includes forming a groove structure on the first surface side by irradiation with laser light such that at least part of the first and second electrodes are exposed to an inside of the groove structure, and forming a plurality of wirings inside of the groove structure.