Invention Grant
- Patent Title: Implantable medical electrical lead construction and associated implant systems
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Application No.: US16114445Application Date: 2018-08-28
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Publication No.: US11278717B2Publication Date: 2022-03-22
- Inventor: Thomas J. Steigauf , Eric H. Bonde , Phillip C. Falkner , Jeevan M. Prasannakumar , Brian T. Stolz , John Shishilla , Adam J. Rivard , Robert Sandgren , Seth Humphrys , Bernard Li
- Applicant: Medtronic, Inc.
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Agency: Mueting Raasch Group
- Main IPC: A61N1/05
- IPC: A61N1/05 ; A61N1/08 ; A61N1/375
Abstract:
A temporary medical electrical lead includes a connector pin and a single conductor coil. The coil being close-wound and having no turns of the coil distal portion being mechanically coupled together. The coil distal portion translates a force of no greater than 0.1 lbf (0.4 N) when strained 400%.
Public/Granted literature
- US20190060636A1 IMPLANTABLE MEDICAL ELECTRICAL LEAD CONSTRUCTION AND ASSOCIATED IMPLANT SYSTEMS Public/Granted day:2019-02-28
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