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    CONNECTOR MODULE ASSEMBLIES, METHODS, AND COMPONENTS FOR IMPLANTABLE MEDICAL ELECTRICAL DEVICES
    2.
    发明申请
    CONNECTOR MODULE ASSEMBLIES, METHODS, AND COMPONENTS FOR IMPLANTABLE MEDICAL ELECTRICAL DEVICES 有权
    用于可植入医疗设备的连接器模块组件，方法和组件

    公开(公告)号：US20140123490A1

    公开(公告)日：2014-05-08

    申请号：US14153109

    申请日：2014-01-13

    Applicant: Medtronic, Inc.

    Inventor： Andrew J. Ries ,  Jeevan M. Prasannakumar ,  Richard P. Nelson

    IPC: A61N1/05

    CPC classification number: A61N1/05 ,  A61N1/3752 ,  H01Q1/273 ,  H01R4/023 ,  H01R4/34 ,  H01R24/58 ,  H01R43/24 ,  H01R2103/00 ,  H01R2201/12 ,  Y10T29/49174 ,  Y10T29/49204

    Abstract: A contact component of an implantable medical device connector module assembly includes a threaded bore in fluid communication with a connector bore thereof, and a flanged bore in fluid communication with the threaded bore. A perimeter surface of the flanged bore creates a shutoff with a pin during injection molding to form an insulative body of the assembly, and a perimeter surface of an insulative bore formed around the pin is preferably flush with that of the flanged bore of the contact component. A centerline axis of the flanged bore is preferably aligned with that of the threaded bore, for example, so that the molded insulative bore has a centerline axis aligned with that of the threaded bore of the contact component.

    Abstract translation: 可植入医疗装置连接器模块组件的接触部件包括与其连接器孔流体连通的螺纹孔和与螺纹孔流体连通的凸缘孔。 凸缘孔的周边表面在注射成型期间产生与销的关闭以形成组件的绝缘体，并且围绕销的形成的绝缘孔的周边表面优选地与接触部件的凸缘孔的周边表面齐平 。 凸缘孔的中心轴线优选地与螺纹孔的中心线对准，例如，使得模制的绝缘孔具有与接触部件的螺纹孔的中心线对准的中心线轴线。

    IMPLANTABLE MEDICAL DEVICE HEADER
    3.
    发明申请
    IMPLANTABLE MEDICAL DEVICE HEADER 有权
    可植入医疗装置头

    公开(公告)号：US20140135882A1

    公开(公告)日：2014-05-15

    申请号：US13676839

    申请日：2012-11-14

    Applicant: MEDTRONIC, INC.

    Inventor： Jeevan M. Prasannakumar ,  Christopher M. Haenisch ,  David Bates ,  John C. Olson ,  George Patras ,  Yanzhu Zhao ,  Jason P. Weiand

    IPC: A61N1/05

    CPC classification number: A61N1/05 ,  A61N1/3752 ,  Y10T29/49016 ,  Y10T29/49117

    Abstract: Techniques for forming a header for an implantable medical device via a two-shot molding process are described. The two-shot molding processes may include a first molding step that creates a first-shot assembly and a second molding step that creates a second-shot assembly. The first-shot assembly may be formed to include one or more protrusions configured to interact with a second-shot mold and/or molding material in the second molding step. The second molding step may be configured to overmold the first-shot assembly. The header may include an attachment plate at least partially embedded in molding material and configured to be mechanically coupled to a body of the implantable medical device.

    Abstract translation: 描述了通过双注射成型工艺形成可植入医疗装置的头部的技术。 双射模制过程可以包括第一模制步骤，其创建第一模制组件和第二模制步骤，其创建二次组装。 第一射出组件可以形成为包括被配置为在第二模制步骤中与二次注射模具和/或模制材料相互作用的一个或多个突起。 第二模制步骤可以被配置为包覆模制第一射出组件。 集管可以包括至少部分地嵌入模制材料中并被配置为机械地联接到可植入医疗装置的主体的附接板。

    Connector module assemblies, methods, and components for implantable medical electrical devices
    7.
    发明授权
    Connector module assemblies, methods, and components for implantable medical electrical devices 有权
    用于可植入医疗电气设备的连接器模块组件，方法和部件

    公开(公告)号：US09079014B2

    公开(公告)日：2015-07-14

    申请号：US14153109

    申请日：2014-01-13

    Applicant: Medtronic, Inc.

    Inventor： Andrew J. Ries ,  Jeevan M. Prasannakumar ,  Richard P. Nelson

    IPC: H01R13/405 ,  A61N1/05 ,  H01R43/24 ,  A61N1/375 ,  H01Q1/27 ,  H01R103/00 ,  H01R4/02 ,  H01R4/34 ,  H01R24/58

    CPC classification number: A61N1/05 ,  A61N1/3752 ,  H01Q1/273 ,  H01R4/023 ,  H01R4/34 ,  H01R24/58 ,  H01R43/24 ,  H01R2103/00 ,  H01R2201/12 ,  Y10T29/49174 ,  Y10T29/49204

    Abstract: A contact component of an implantable medical device connector module assembly includes a threaded bore in fluid communication with a connector bore thereof, and a flanged bore in fluid communication with the threaded bore. A perimeter surface of the flanged bore creates a shutoff with a pin during injection molding to form an insulative body of the assembly, and a perimeter surface of an insulative bore formed around the pin is preferably flush with that of the flanged bore of the contact component. A centerline axis of the flanged bore is preferably aligned with that of the threaded bore, for example, so that the molded insulative bore has a centerline axis aligned with that of the threaded bore of the contact component.

    Abstract translation: 可植入医疗装置连接器模块组件的接触部件包括与其连接器孔流体连通的螺纹孔和与螺纹孔流体连通的凸缘孔。 凸缘孔的周边表面在注射成型期间产生与销的关闭以形成组件的绝缘体，并且围绕销的形成的绝缘孔的周边表面优选地与接触部件的凸缘孔的周边表面齐平 。 凸缘孔的中心轴线优选地与螺纹孔的中心线对准，例如，使得模制的绝缘孔具有与接触部件的螺纹孔的中心线对准的中心线轴线。

    Implantable medical device header
    8.
    发明授权
    Implantable medical device header 有权
    可植入医疗器械头

    公开(公告)号：US08989872B2

    公开(公告)日：2015-03-24

    申请号：US13676839

    申请日：2012-11-14

    Applicant: Medtronic, Inc.

    Inventor： Jeevan M. Prasannakumar ,  Christopher M. Haenisch ,  David Bates ,  John C. Olson ,  George Patras ,  Yanzhu Zhao ,  Jason P. Weiand

    IPC: A61N1/05 ,  A61N1/375

    CPC classification number: A61N1/05 ,  A61N1/3752 ,  Y10T29/49016 ,  Y10T29/49117

    Abstract: Techniques for forming a header for an implantable medical device via a two-shot molding process are described. The two-shot molding processes may include a first molding step that creates a first-shot assembly and a second molding step that creates a second-shot assembly. The first-shot assembly may be formed to include one or more protrusions configured to interact with a second-shot mold and/or molding material in the second molding step. The second molding step may be configured to overmold the first-shot assembly. The header may include an attachment plate at least partially embedded in molding material and configured to be mechanically coupled to a body of the implantable medical device.

    Abstract translation: 描述了通过双注射成型工艺形成可植入医疗装置的头部的技术。 双射模制过程可以包括第一模制步骤，其创建第一模制组件和第二模制步骤，其创建二次组装。 第一射出组件可以形成为包括被配置为在第二模制步骤中与二次注射模具和/或模制材料相互作用的一个或多个突起。 第二模制步骤可以被配置为包覆模制第一射出组件。 集管可以包括至少部分地嵌入模制材料中并被配置为机械地联接到可植入医疗装置的主体的附接板。

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