An electronic device is provided with a substrate mounted with an electronic component, an expansion card disposed at an interval from the substrate, a flexible printed circuit electrically connecting the substrate and the expansion card, a connector which is provided in the flexible printed circuit and to which a terminal of the expansion card is connected, a cooling unit having a heat transport member thermally connected to the electronic component and a cooling fan cooling the heat transport member, a bracket fixed to the connector, and a chassis housing the substrate, the expansion card, the flexible printed circuit, the connector, the cooling unit, and the bracket, in which the cooling fan is disposed between the substrate and the expansion card and overlaps with the flexible printed circuit in the plan view and the bracket is fixed to the chassis.