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公开(公告)号：US20210089094A1
公开(公告)日：2021-03-25
申请号：US16701733
申请日：2019-12-03
发明人： Kenji Watamura , Jun Kaminaga , Hirohide Komiyama
摘要： An electronic device is provided with a substrate mounted with an electronic component, an expansion card disposed at an interval from the substrate, a flexible printed circuit electrically connecting the substrate and the expansion card, a connector which is provided in the flexible printed circuit and to which a terminal of the expansion card is connected, a cooling unit having a heat transport member thermally connected to the electronic component and a cooling fan cooling the heat transport member, a bracket fixed to the connector, and a chassis housing the substrate, the expansion card, the flexible printed circuit, the connector, the cooling unit, and the bracket, in which the cooling fan is disposed between the substrate and the expansion card and overlaps with the flexible printed circuit in the plan view and the bracket is fixed to the chassis.
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公开(公告)号：US11281265B2
公开(公告)日：2022-03-22
申请号：US16701733
申请日：2019-12-03
发明人： Kenji Watamura , Jun Kaminaga , Hirohide Komiyama
摘要： An electronic device is provided with a substrate mounted with an electronic component, an expansion card disposed at an interval from the substrate, a flexible printed circuit electrically connecting the substrate and the expansion card, a connector which is provided in the flexible printed circuit and to which a terminal of the expansion card is connected, a cooling unit having a heat transport member thermally connected to the electronic component and a cooling fan cooling the heat transport member, a bracket fixed to the connector, and a chassis housing the substrate, the expansion card, the flexible printed circuit, the connector, the cooling unit, and the bracket, in which the cooling fan is disposed between the substrate and the expansion card and overlaps with the flexible printed circuit in the plan view and the bracket is fixed to the chassis.
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公开(公告)号：US20210100099A1
公开(公告)日：2021-04-01
申请号：US16701905
申请日：2019-12-03
发明人： Hirohide Komiyama , Jun Kaminaga , Kenji Watamura
IPC分类号： H05K1/11 , G01R31/319 , H01R12/70
摘要： An electronic component includes: a board body including a connection pad formed in a terminal portion that is a region including at least an edge portion of a first main surface; a first cover layer covering the first main surface so that at least the terminal portion is exposed; and a second cover layer formed on the first main surface so as to surround at least part of the terminal portion. The second cover layer has a shape in a plan view that enables positioning of a fixture. The fixture includes a terminal electrically connectable to the connection pad, and is removably connectable to the board body.
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公开(公告)号：US10892575B1
公开(公告)日：2021-01-12
申请号：US16718609
申请日：2019-12-18
发明人： Hirohide Komiyama , Jun Kaminaga , Kenji Watamura
摘要： An electronic component includes a first substrate including first connection terminals in an end region on a first surface; and a second substrate including second connection terminals on a first surface, the second connection terminals being disposed at a position corresponding to the first connection terminals. Each of the first connection terminals includes a base and an elastic contact piece extending from the base. The elastic contact piece is elastically deformable in a direction in which the tip end portion thereof approaches and departs with respect to the base. The first connection terminals are electrically connected to the second connection terminals while having the first surface of the first substrate being opposed to the first surface of the second substrate, and the second connection terminals being pressed onto the elastic contact pieces.
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