- 专利标题： Semiconductor package structure and electronic device
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申请号： US16717929申请日： 2019-12-17
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公开(公告)号： US11282767B2公开(公告)日： 2022-03-22
- 发明人: Hsin-En Chen , Ian Hu , Jung-Che Tsai
- 申请人： Advanced Semiconductor Engineering, Inc.
- 申请人地址： TW Kaohsiung
- 专利权人： Advanced Semiconductor Engineering, Inc.
- 当前专利权人： Advanced Semiconductor Engineering, Inc.
- 当前专利权人地址： TW Kaohsiung
- 代理机构： Foley & Lardner LLP
- 主分类号： H01L23/427
- IPC分类号： H01L23/427 ; H01L23/46 ; H01L23/48 ; H01L23/40
摘要：
A semiconductor package structure includes a package substrate and a semiconductor die. The package substrate includes a plurality of hollow vias extending through the package substrate. The semiconductor die is electrically connected to the package substrate. The hollow vias are disposed under the semiconductor die.
公开/授权文献
- US20200266123A1 SEMICONDUCTOR PACKAGE STRUCTURE AND ELECTRONIC DEVICE 公开/授权日：2020-08-20
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