公开(公告)号：US11205606B2

公开(公告)日：2021-12-21

申请号：US16730400

申请日：2019-12-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-En Chen ,  Hung-Hsien Huang ,  Shin-Luh Tarng

IPC: H01L23/373 ,  H01L23/498

Abstract: A semiconductor device package includes a semiconductor die and an anisotropic thermal conductive structure. The semiconductor die includes a first surface, a second surface opposite to the first surface and edges connecting the first surface to the second surface. The anisotropic thermal conductive structure has different thermal conductivities in different directions. The anisotropic thermal conductive structure includes at least two pairs of film stacks, and each pair of the film stacks comprises a metal film and a nano-structural film alternately stacked. The anisotropic thermal conductive structure comprises a first thermal conductive section disposed on the first surface of the semiconductor die, and the first thermal conductive section is wider than the semiconductor die.

公开(公告)号：US10685899B2

公开(公告)日：2020-06-16

申请号：US16156984

申请日：2018-10-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-En Chen

IPC: H01L23/367 ,  H01L23/40 ,  F28F13/06

Abstract: A conductive lid includes a body including a first portion extended from the body and bent toward a first direction; a second portion extended from the body and bent toward the first direction; and a third portion extended from the second portion and bent toward a second direction different from the first direction.

公开(公告)号：US11081420B2

公开(公告)日：2021-08-03

申请号：US16508210

申请日：2019-07-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-En Chen ,  Ian Hu ,  Chih-Pin Hung

IPC: H01L23/34 ,  H01L23/367 ,  H01L23/427

Abstract: A semiconductor package structure includes a package substrate, at least one semiconductor die, a heat dissipating device, at least one electronic device and a heat transmitting structure. The package substrate has a first surface and a second surface opposite to the first surface. The semiconductor die is electrically connected to the first surface of the package substrate. The heat dissipating device is thermally connected to the first surface of the package substrate. The electronic device is electrically connected to the second surface of the package substrate. The electronic device has a first surface and a second surface opposite to the first surface, and the first surface of the electronic device faces the second surface of the package substrate. The heat transmitting structure is disposed adjacent to the second surface of the package substrate, and thermally connected to the electronic device and the heat dissipating device.

公开(公告)号：US20210013118A1

公开(公告)日：2021-01-14

申请号：US16508210

申请日：2019-07-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-En Chen ,  Ian Hu ,  Chih-Pin Hung

IPC: H01L23/367 ,  H01L23/427

Abstract: A semiconductor package structure includes a package substrate, at least one semiconductor die, a heat dissipating device, at least one electronic device and a heat transmitting structure. The package substrate has a first surface and a second surface opposite to the first surface. The semiconductor die is electrically connected to the first surface of the package substrate. The heat dissipating device is thermally connected to the first surface of the package substrate. The electronic device is electrically connected to the second surface of the package substrate. The electronic device has a first surface and a second surface opposite to the first surface, and the first surface of the electronic device faces the second surface of the package substrate. The heat transmitting structure is disposed adjacent to the second surface of the package substrate, and thermally connected to the electronic device and the heat dissipating device.

公开(公告)号：US11282767B2

公开(公告)日：2022-03-22

申请号：US16717929

申请日：2019-12-17

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-En Chen ,  Ian Hu ,  Jung-Che Tsai

IPC: H01L23/427 ,  H01L23/46 ,  H01L23/48 ,  H01L23/40

Abstract: A semiconductor package structure includes a package substrate and a semiconductor die. The package substrate includes a plurality of hollow vias extending through the package substrate. The semiconductor die is electrically connected to the package substrate. The hollow vias are disposed under the semiconductor die.

公开(公告)号：US11139226B2

公开(公告)日：2021-10-05

申请号：US16579345

申请日：2019-09-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-En Chen ,  Ian Hu ,  Hung-Hsien Huang

IPC: H01L23/46 ,  H01L23/495 ,  H01L23/367 ,  H01L23/31 ,  H01L23/473 ,  H01L23/427

Abstract: A semiconductor package structure includes a vapor chamber, a plurality of electrical contacts, a semiconductor die and an encapsulant. The vapor chamber defines an enclosed chamber for accommodating a working liquid. The electrical contacts surround the vapor chamber. The semiconductor die is disposed on the vapor chamber, and electrically connected to the electrical contacts through a plurality of bonding wires. The encapsulant covers a portion of the vapor chamber, portions of the electrical contacts, the semiconductor die and the bonding wires.

公开(公告)号：US11024557B2

公开(公告)日：2021-06-01

申请号：US16566495

申请日：2019-09-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-En Chen ,  Ian Hu ,  Jin-Feng Yang

IPC: H01L23/427 ,  H01L23/00

Abstract: A semiconductor package structure includes a package substrate, a semiconductor die, a vapor chamber and a heat dissipating device. The package substrate has a first surface and a second surface opposite to the first surface. The semiconductor die is electrically connected to the first surface of the package substrate. The vapor chamber is thermally connected to a first surface of the semiconductor die. The vapor chamber defines an enclosed chamber for accommodating a first working liquid. The heat dissipating device is thermally connected to the vapor chamber. The heat dissipating device defines a substantially enclosed space for accommodating a second working liquid.