- 专利标题: Surface-emitting laser and method for manufacturing surface-emitting laser
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申请号: US16488595申请日: 2018-02-27
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公开(公告)号: US11283243B2公开(公告)日: 2022-03-22
- 发明人: Susumu Noda , Yoshinori Tanaka , Menaka De Zoysa , Junichi Sonoda , Tomoaki Koizumi , Kei Emoto
- 申请人: KYOTO UNIVERSITY , STANLEY ELECTRIC CO., LTD.
- 申请人地址: JP Kyoto; JP Tokyo
- 专利权人: KYOTO UNIVERSITY,STANLEY ELECTRIC CO., LTD.
- 当前专利权人: KYOTO UNIVERSITY,STANLEY ELECTRIC CO., LTD.
- 当前专利权人地址: JP Kyoto; JP Tokyo
- 代理机构: Holtz, Holtz & Volek PC
- 优先权: JPJP2017-035504 20170227
- 国际申请: PCT/JP2018/007272 WO 20180227
- 国际公布: WO2018/155710 WO 20180830
- 主分类号: H01S5/02216
- IPC分类号: H01S5/02216 ; H01S5/22 ; H01S5/18 ; H01S5/32 ; H01L21/02 ; H01S5/11 ; H01S5/12 ; H01S5/20
摘要:
A method for manufacturing a surface emitting laser made of a group-III nitride semiconductor by an MOVPE method includes: (a) growing a first cladding layer of a first conductive type on a substrate; (b) growing a first optical guide layer of the first conductive type on the first cladding layer; (c) forming holes having a two-dimensional periodicity in a plane parallel to the first optical guide layer, in the first optical guide layer by etching; (d) supplying a gas containing a group-III material and a nitrogen source and performing growth to form recessed portions having a facet of a predetermined plane direction above openings of the holes, thereby closing the openings of the holes; and (e) planarizing the recessed portions by mass transport, after the openings of the holes have been closed, wherein after the planarizing at least one side surface of the holes is a {10-10} facet.