Invention Grant
- Patent Title: Logic circuitry package
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Application No.: US16767589Application Date: 2019-12-03
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Publication No.: US11292261B2Publication Date: 2022-04-05
- Inventor: Jefferson P. Ward
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Spring
- Agency: Dicke Billig & Czaja PLLC
- International Application: PCT/US2019/064196 WO 20191203
- International Announcement: WO2020/117776 WO 20200611
- Main IPC: B41J2/175
- IPC: B41J2/175 ; G06F13/42 ; G06F21/44

Abstract:
A logic circuitry package for a print apparatus component includes an interface to communicate with a print apparatus logic circuit, and at least one logic circuit. The at least one logic circuit is configured to receive, via the interface, a command series addressed to a first default address and a second default address, and transmit, via the interface, at least one response in response to at least one command of the command series. The at least one logic circuit is configured to receive, via the interface, an other command series addressed to an other first default address and subsequently, the second default address, and transmit, via the interface, at least one other response in response to at least one other command of the other command series.
Public/Granted literature
- US20210213747A1 LOGIC CIRCUITRY PACKAGE Public/Granted day:2021-07-15
Information query
IPC分类: