Invention Grant
- Patent Title: Cleaning apparatus and cleaning method of substrate processing apparatus
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Application No.: US16188671Application Date: 2018-11-13
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Publication No.: US11295965B2Publication Date: 2022-04-05
- Inventor: Kohei Yamada , Hiroaki Inadomi , Satoshi Biwa
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Abelman, Frayne & Schwab
- Priority: JPJP2017-218700 20171114
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/02 ; H01L21/677 ; B08B9/093 ; B08B3/02
Abstract:
A cleaning apparatus of a substrate processing apparatus according to an exemplary embodiment includes a nozzle and a scanner. The nozzle ejects a gas toward in an inner wall surface of a processing chamber in which a substrate is processed. The scanner causes the nozzle to scan along the inner wall surface of the processing chamber in the processing chamber.
Public/Granted literature
- US20190148182A1 CLEANING APPARATUS AND CLEANING METHOD OF SUBSTRATE PROCESSING APPARATUS Public/Granted day:2019-05-16
Information query
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