Invention Grant
- Patent Title: Semiconductor device and method of fabricating same
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Application No.: US17007265Application Date: 2020-08-31
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Publication No.: US11296029B2Publication Date: 2022-04-05
- Inventor: Ju Youn Kim , Deok Han Bae , Jin-Wook Kim , Ju Hun Park , Myung Yoon Um , In Yeal Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Volentine, Whitt & Francos, PLLC
- Priority: KR10-2020-0009800 20200128
- Main IPC: H01L23/535
- IPC: H01L23/535 ; H01L29/06 ; H01L29/423 ; H01L29/417 ; H01L29/786 ; H01L29/08 ; H01L29/78 ; H01L21/3213 ; H01L21/768

Abstract:
A semiconductor device includes an active pattern extending in a first horizontal direction on a substrate, a gate electrode extending in a second horizontal direction across the active pattern, and including a first portion, and a second portion protruding upward from the first portion in a vertical direction, a capping pattern extending in the second horizontal direction on the gate electrode, and a gate contact disposed on the second portion of the gate electrode, overlapping the active pattern, and penetrating the capping pattern to connect the gate electrode.
Public/Granted literature
- US20210233847A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING SAME Public/Granted day:2021-07-29
Information query
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