- Patent Title: Semiconductor device packages and methods of manufacturing the same
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Application No.: US16703409Application Date: 2019-12-04
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Publication No.: US11296043B2Publication Date: 2022-04-05
- Inventor: Cheng-Yuan Kung , Hung-Yi Lin , Chang-Yu Lin
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L23/367
- IPC: H01L23/367 ; H01L23/64 ; H01L23/00 ; H01L21/56
Abstract:
A semiconductor device package includes a redistribution layer (RDL), a semiconductor device, a transceiver, and a capacitor. The RDL has a first surface and a second surface opposite to the first surface. The semiconductor device is disposed on the first surface of the RDL. The transceiver is disposed on the second surface of the RDL. The capacitor is disposed on the second surface of the RDL. The semiconductor device has a first projected area and the capacitance has a second projected area. The first projected area overlaps with the second projected area.
Public/Granted literature
- US20210175189A1 SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME Public/Granted day:2021-06-10
Information query
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