公开(公告)号：US10903907B1

公开(公告)日：2021-01-26

申请号：US16702209

申请日：2019-12-03

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Yu Lin ,  Cheng-Yuan Kung ,  Hung-Yi Lin

IPC: H04B10/00 ,  H04B10/40 ,  G02B6/42 ,  H04J14/00

Abstract: A system including optical devices is provided. The system includes a first substrate and a first device for optical communication. The first device has a first surface, a second surface opposite to the first surface, and a first side contiguous with the first surface and the second surface. Moreover, the first side is smaller than one of the first surface and the second surface in terms of area. The first device is attached at the first side thereof to the first substrate.

公开(公告)号：US12266644B2

公开(公告)日：2025-04-01

申请号：US17170666

申请日：2021-02-08

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Yu Lin ,  Chi-Han Chen ,  Chieh-Chen Fu

IPC: H01L25/16 ,  H01L23/538 ,  H01L33/52 ,  H01L33/58 ,  G02B6/42

Abstract: A semiconductor device package includes a first semiconductor device having a first surface, an interconnection element having a surface substantially coplanar with the first surface of the first semiconductor device, a first encapsulant encapsulating the first semiconductor device and the interconnection element, and a second semiconductor device disposed on and across the first semiconductor device and the interconnection element.

公开(公告)号：US11722220B2

公开(公告)日：2023-08-08

申请号：US17144938

申请日：2021-01-08

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Yu Lin ,  Cheng-Yuan Kung ,  Hung-Yi Lin

IPC: H04B10/00 ,  H04B10/40 ,  G02B6/42 ,  H04J14/00

CPC classification number: H04B10/40 ,  G02B6/4206 ,  G02B6/4257

Abstract: A system including optical devices is provided. The system includes a first substrate and a first device for optical communication. The first device has a first surface, a second surface opposite to the first surface, and a first side contiguous with the first surface and the second surface. Moreover, the first side is smaller than one of the first surface and the second surface in terms of area. The first device is attached at the first side thereof to the first substrate.

公开(公告)号：US11296043B2

公开(公告)日：2022-04-05

申请号：US16703409

申请日：2019-12-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Yuan Kung ,  Hung-Yi Lin ,  Chang-Yu Lin

IPC: H01L23/367 ,  H01L23/64 ,  H01L23/00 ,  H01L21/56

Abstract: A semiconductor device package includes a redistribution layer (RDL), a semiconductor device, a transceiver, and a capacitor. The RDL has a first surface and a second surface opposite to the first surface. The semiconductor device is disposed on the first surface of the RDL. The transceiver is disposed on the second surface of the RDL. The capacitor is disposed on the second surface of the RDL. The semiconductor device has a first projected area and the capacitance has a second projected area. The first projected area overlaps with the second projected area.

公开(公告)号：US11942585B2

公开(公告)日：2024-03-26

申请号：US17367052

申请日：2021-07-02

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Hsuan Wu ,  Chang-Yu Lin ,  Yu-Sheng Huang

IPC: H01L33/62 ,  G02B6/12 ,  H01L23/488 ,  H01L31/0224 ,  H01L31/0232 ,  H01L33/58

CPC classification number: H01L33/62 ,  G02B6/12 ,  H01L23/488 ,  H01L31/0224 ,  H01L31/0232 ,  H01L33/58

Abstract: An optoelectronic package structure and a method of manufacturing an optoelectronic package structure are provided. The optoelectronic package structure includes a photonic component. The photonic component has an electrical connection region, a blocking region and a region for accommodating a device. The blocking region is located between the electrical connection region and the region for accommodating a device.

公开(公告)号：US10930627B2

公开(公告)日：2021-02-23

申请号：US16236186

申请日：2018-12-28

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Yu Lin ,  Chi-Han Chen ,  Chieh-Chen Fu

IPC: H01L25/16 ,  H01L33/52 ,  H01L23/538 ,  H01L33/58 ,  G02B6/42

Abstract: A semiconductor device package includes a first semiconductor device having a first surface, an interconnection element having a surface substantially coplanar with the first surface of the first semiconductor device, a first encapsulant encapsulating the first semiconductor device and the interconnection element, and a second semiconductor device disposed on and across the first semiconductor device and the interconnection element.

公开(公告)号：US12100697B2

公开(公告)日：2024-09-24

申请号：US17185499

申请日：2021-02-25

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Yu Lin ,  Cheng-Hsuan Wu

IPC: H01L23/48 ,  G02B6/42 ,  H01L21/78 ,  H01L23/00 ,  H01L23/31 ,  H01L23/52 ,  H01L25/16

CPC classification number: H01L25/167 ,  G02B6/4202 ,  H01L21/78 ,  H01L23/3107 ,  H01L24/24 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16225 ,  H01L2224/214 ,  H01L2224/24146 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73259 ,  H01L2224/83203

Abstract: A semiconductor package structure and a method of manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a first electronic device and a second electronic device. The first electronic device has an active surface and a lateral surface angled with the active surface, and the lateral surface includes a first portion and a second portion that is non-coplanar with the first portion. The second electronic device is disposed on the active surface of the first electronic device.

公开(公告)号：US11837566B2

公开(公告)日：2023-12-05

申请号：US17534358

申请日：2021-11-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Ju Lu ,  Chi-Han Chen ,  Chang-Yu Lin ,  Jr-Wei Lin ,  Chih-Pin Hung

IPC: H01L23/00

CPC classification number: H01L24/17 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/02373 ,  H01L2224/02375 ,  H01L2224/02377 ,  H01L2224/02381 ,  H01L2224/13024 ,  H01L2224/13082 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/17177 ,  H01L2224/73204 ,  H01L2224/81951

Abstract: An electronic device package includes a circuit layer, a first semiconductor die, a second semiconductor die, a plurality of first conductive structures and a second conductive structure. The first semiconductor die is disposed on the circuit layer. The second semiconductor die is disposed on the first semiconductor die, and has an active surface toward the circuit layer. The first conductive structures are disposed between a first region of the second semiconductor die and the first semiconductor die, and electrically connecting the first semiconductor die to the second semiconductor die. The second conductive structure is disposed between a second region of the second semiconductor die and the circuit layer, and electrically connecting the circuit layer to the second semiconductor die.

公开(公告)号：US11183474B2

公开(公告)日：2021-11-23

申请号：US16673699

申请日：2019-11-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Ju Lu ,  Chi-Han Chen ,  Chang-Yu Lin ,  Jr-Wei Lin ,  Chih-Pin Hung

IPC: H01L23/00

Abstract: An electronic device package includes a circuit layer, a first semiconductor die, a second semiconductor die, a plurality of first conductive structures and a second conductive structure. The first semiconductor die is disposed on the circuit layer. The second semiconductor die is disposed on the first semiconductor die, and has an active surface toward the circuit layer. The first conductive structures are disposed between a first region of the second semiconductor die and the first semiconductor die, and electrically connecting the first semiconductor die to the second semiconductor die. The second conductive structure is disposed between a second region of the second semiconductor die and the circuit layer, and electrically connecting the circuit layer to the second semiconductor die.