Invention Grant
- Patent Title: Packet duplication for high reliability communication
-
Application No.: US16662822Application Date: 2019-10-24
-
Publication No.: US11297644B2Publication Date: 2022-04-05
- Inventor: Srinivas Yerramalli , Xiaoxia Zhang , Seyed Ali Akbar Fakoorian
- Applicant: QUALCOMM incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM incorporated
- Current Assignee: QUALCOMM incorporated
- Current Assignee Address: US CA San Diego
- Agency: Holland & Hart LLP
- Main IPC: H04L1/18
- IPC: H04L1/18 ; H04W8/24 ; H04W72/04 ; H04W72/14 ; H04W74/00 ; H04W74/08 ; H04W80/02 ; H04W80/08 ; H04W84/04 ; H04W84/12 ; H04W88/02 ; H04W88/08 ; H04W92/02 ; H04W92/10

Abstract:
Methods, systems, and devices for wireless communication are described. Generally, the described techniques provide for increasing the chances that a high reliability packet scheduled to be transmitted in a shared radio frequency spectrum is received by a receiving device. In one example, a wireless device (e.g., a base station or a user equipment (UE)) may duplicate a packet at a packet data convergence protocol (PDCP) layer for transmission on multiple listen before talk (LBT) subchannels of a carrier to improve reliability. In another example, a wireless device may duplicate a packet at a physical (PHY) layer for transmission on multiple LBT subchannels of a carrier to improve reliability, or the wireless device may encode and map the packet to multiple LBT subchannels of a carrier for transmission on the multiple LBT subchannels to improve reliability.
Information query