Invention Grant
- Patent Title: Electronic component pressing apparatus and electronic component testing apparatus
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Application No.: US17018456Application Date: 2020-09-11
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Publication No.: US11300609B2Publication Date: 2022-04-12
- Inventor: Yasuyuki Kato , Natsuki Shiota
- Applicant: ADVANTEST Corporation
- Applicant Address: JP Tokyo
- Assignee: ADVANTEST Corporation
- Current Assignee: ADVANTEST Corporation
- Current Assignee Address: JP Tokyo
- Agency: Osha Bergman Watanabe & Burton LLP
- Main IPC: G01R31/28
- IPC: G01R31/28

Abstract:
An electronic component presser is included in an electronic component testing apparatus used to test a device under test (DUT). The electronic component testing apparatus includes an electronic component handler, an electronic component tester, and a first socket. The electronic component presser connects to the electronic component handler and to the electronic component tester. The electronic component presser includes: a holding plate that holds the DUT that has been carried to the holding plate by a contact arm of the electronic component handler; a transport unit that moves the DUT between the holding plate and the first socket; a pusher that presses the DUT that has been disposed on the first socket; and an antenna unit comprising a measurement antenna that faces a device antenna of the DUT disposed on the first socket.
Public/Granted literature
- US20220082613A1 ELECTRONIC COMPONENT PRESSING APPARATUS AND ELECTRONIC COMPONENT TESTING APPARATUS Public/Granted day:2022-03-17
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