- 专利标题: Metal smart card with dual interface capability
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申请号: US16935948申请日: 2020-07-22
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公开(公告)号: US11301744B2公开(公告)日: 2022-04-12
- 发明人: John Herslow , Adam Lowe , Luis Dasilva , Brian Nester
- 申请人: CompoSecure, LLC
- 申请人地址: US NJ Somerset
- 专利权人: CompoSecure, LLC
- 当前专利权人: CompoSecure, LLC
- 当前专利权人地址: US NJ Somerset
- 代理机构: Ratner Prestia
- 主分类号: G06K19/077
- IPC分类号: G06K19/077 ; H01L23/66 ; H01Q1/38 ; H01Q1/22
摘要:
A transaction card comprising a metal layer. A first cut out region in a first surface of said metal layer has a depth less than the thickness of the metal layer, and a first portion of an integrated circuit (IC) module is secured therein. A second cut out region extends from the first cut out region to the second surface of said metal layer and defines a non-RF-impeding volume having a perimeter greater than the perimeter of the first cut out region. One or more additional layers are stacked on the second surface of the metal layer, and a channel extends between one of the stacked layers and the IC module.
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