Invention Grant
- Patent Title: Processing apparatus
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Application No.: US16737512Application Date: 2020-01-08
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Publication No.: US11302542B2Publication Date: 2022-04-12
- Inventor: Masato Kadobe , Shinya Nasukawa , Hiromi Nitadori , Kazuyuki Kikuchi , Hirofumi Kaneko
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer; Tanya E. Harkins
- Priority: JPJP2019-002945 20190110,JPJP2019-191462 20191018
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/677 ; F27D5/00 ; F27D7/06 ; F27D9/00 ; F27D3/00

Abstract:
A processing apparatus includes: a plurality of process modules concatenated with one another; and a loader module configured to receive a carrier accommodating a plurality of substrates to be processed by the plurality of process modules, wherein each of the plurality of process modules includes: a heat treatment unit including a processing container configured to accommodate the plurality of substrates and perform a heat treatment on the plurality of substrates; and a gas supply unit disposed on one side surface of the heat treatment unit and configured to supply a gas into the processing container.
Public/Granted literature
- US20200227293A1 PROCESSING APPARATUS Public/Granted day:2020-07-16
Information query
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