Invention Grant
- Patent Title: Semiconductor package and method of manufacturing the same
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Application No.: US16983298Application Date: 2020-08-03
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Publication No.: US11302572B2Publication Date: 2022-04-12
- Inventor: Dowan Kim , Doohwan Lee , Seunghwan Baek
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2019-0176504 20191227
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L23/538 ; H01L23/00 ; H01L23/31

Abstract:
A method of manufacturing a semiconductor package may include forming a first substrate including a redistribution layer, providing a second substrate including a semiconductor chip and an interconnection layer on the first substrate to connect the semiconductor chip to the redistribution layer, forming a first encapsulation layer covering the second substrate, and forming a via structure penetrating the first encapsulation layer. The forming the via structure may include forming a first via hole in the first encapsulation layer, forming a photosensitive material layer in the first via hole, exposing and developing the photosensitive material layer in the first via hole to form a second encapsulation layer having a second via hole, and filling the second via hole with a conductive material. A surface roughness of a sidewall of the first encapsulation layer may be greater than a surface roughness of a sidewall of the second encapsulation layer.
Public/Granted literature
- US20210202303A1 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2021-07-01
Information query
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