Re-depositing of metal-containing particles of an embedded electrically conductive structure onto sidewalls of an overlying metal-containing structure is alleviated in the present application by providing a pedestal structure between the embedded electrically conductive structure and the metal-containing structure, wherein the pedestal structure has a flared sidewall that extends beyond a perimeter of the embedded electrically conductive structure. Such a pedestal structure (which can be referred to herein as a footing flare pedestal structure) mitigates, and in some embodiments, entirely eliminates, the exposure of the embedded electrically conductive structure during the patterning of metal-containing layers formed atop the embedded electrically conductive structure.