Invention Grant
- Patent Title: Laminated stiffener to control the warpage of electronic chip carriers
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Application No.: US16575549Application Date: 2019-09-19
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Publication No.: US11302651B2Publication Date: 2022-04-12
- Inventor: Kamal K. Sikka , Krishna R. Tunga , Hilton T. Toy , Thomas Weiss , Shidong Li , Sushumna Iruvanti
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent L. Jeffrey Kelly
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/11 ; H01L23/00 ; H01L23/498 ; H01L21/48 ; H01L21/027 ; H05K3/30 ; H05K1/18 ; H05K1/03
Abstract:
A technique relates to an electronic package. A substrate is configured to receive a chip. A stiffener is attached to the substrate. The stiffener includes a core material with a first material formed on opposing sides of the core material.
Public/Granted literature
- US20200013732A1 LAMINATED STIFFENER TO CONTROL THE WARPAGE OF ELECTRONIC CHIP CARRIERS Public/Granted day:2020-01-09
Information query
