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公开(公告)号：US20230130104A1
公开(公告)日：2023-04-27
申请号：US17451827
申请日：2021-10-22
发明人： Sushumna Iruvanti , James Busby , Philipp K. Buchling Rego , Steven Paul Ostrander , Thomas Anthony Wassick , William Santiago-Fernandez , Nihad Hadzic
IPC分类号： H01L23/367 , H01L23/00 , H01L25/065 , H01L23/498 , H01L25/18
摘要： A laminate carrier-like module lid including multiple laminate layers of non-conductive materials stacked one atop another, sensor circuitry embedded within the laminate carrier-like module lid, the sensor circuitry providing a continuous electrical circuit surrounding the electronic components of the multi-chip module package, and thermal circuitry embedded within the laminate carrier-like module lid, the thermal circuitry comprising solid copper traces to thermally conduct heat from the electronic components of the multi-chip module package.
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公开(公告)号：US11569181B2
公开(公告)日：2023-01-31
申请号：US17113032
申请日：2020-12-05
IPC分类号： H01L23/00 , H01L21/02 , H01L23/26 , H01L21/768
摘要： Moisture-driven degradation of a crack stop in a semiconductor die is mitigated by forming a groove in an upper surface of the die between an edge of the die and the crack stop; entirely filling the groove with a moisture barrier material; preventing moisture penetration of the semiconductor die by presence of the moisture barrier material; and dissipating mechanical stress in the moisture barrier material without presenting a stress riser in the bulk portion of the die. The moisture barrier material is at least one of moisture-absorbing, moisture adsorbing, and hydrophobic.
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公开(公告)号：US20210249333A1
公开(公告)日：2021-08-12
申请号：US16787241
申请日：2020-02-11
IPC分类号： H01L23/40 , H01L23/427 , F28F13/00
摘要： An integrated circuit (IC) device package includes an IC device connected to an upper surface of the IC device carrier. Due to operation conditions or IC device package makeup, the IC device may warp. The warped IC device may include a convex upper surface. A conformable lid is connected to the IC device and includes an internal chamber and a deformable floor. The deformable floor is able to deform or bend along with the IC device. After deformation, the deformable floor may include a concave lower surface. A uniform bond line thickness of a thermal interface material that connects the IC device and the conformable lid is able to be achieved due to the deformable floor deforming or bending along with the IC device.
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公开(公告)号：US10892233B2
公开(公告)日：2021-01-12
申请号：US16177100
申请日：2018-10-31
IPC分类号： H01L23/00 , H01L21/02 , H01L23/26 , H01L21/768
摘要： Moisture-driven degradation of a crack stop in a semiconductor die is mitigated by forming a groove in an upper surface of the die between an edge of the die and the crack stop; entirely filling the groove with a moisture barrier material; preventing moisture penetration of the semiconductor die by presence of the moisture barrier material; and dissipating mechanical stress in the moisture barrier material without presenting a stress riser in the bulk portion of the die. The moisture barrier material is at least one of moisture-absorbing, moisture adsorbing, and hydrophobic.
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公开(公告)号：US20180076101A1
公开(公告)日：2018-03-15
申请号：US15813536
申请日：2017-11-15
发明人： Sushumna Iruvanti , Shidong Li , Marek A. Orlowski , David L. Questad , Tuhin Sinha , Krishna R. Tunga , Thomas A. Wassick , Randall J. Werner , Jeffrey A. Zitz
IPC分类号： H01L21/66 , H01L21/48 , H01L23/498 , G06F17/50
CPC分类号： H01L22/32 , G06F17/5068 , H01L21/4857 , H01L21/486 , H01L23/49822 , H01L23/49827 , H01L23/49866 , H01L2224/16225 , H01L2924/15311
摘要： A laminate includes a plurality of buildup layers disposed on a core and a plurality of unit cells defined in the buildup layers. Each unit cell includes: at least one test via that passes through at least two of the buildup layers and that is electrically connected to testing locations on a probe accessible location of the laminate; and two or more dummy vias disposed in the unit cell. The dummy vias are arranged in the unit cell at one of a plurality of distances from the test via.
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公开(公告)号：US20180068917A1
公开(公告)日：2018-03-08
申请号：US15811645
申请日：2017-11-13
CPC分类号： H01L23/10 , H01L21/50 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/73 , H01L24/83 , H01L24/92 , H01L2224/131 , H01L2224/16227 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2224/81815 , H01L2224/83191 , H01L2224/83192 , H01L2224/92125 , H01L2224/92225 , H01L2924/15311 , H01L2924/15312 , H01L2924/15313 , H01L2924/15787 , H01L2924/1579 , H01L2924/16195 , H01L2924/163 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/3511
摘要： In yet another aspect the electronic package further includes a frame concentric with the chip. The lid is attached to the frame with a solder, epoxy or elastomer and placed on the chip with a thermal interface material. The seal band material is dispensed on the chip carrier and the frame is then moved towards the chip carrier allowing a minimum seal band thickness.
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公开(公告)号：US20180068916A1
公开(公告)日：2018-03-08
申请号：US15811641
申请日：2017-11-13
CPC分类号： H01L23/10 , H01L21/50 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/73 , H01L24/83 , H01L24/92 , H01L2224/131 , H01L2224/16227 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2224/81815 , H01L2224/83191 , H01L2224/83192 , H01L2224/92125 , H01L2224/92225 , H01L2924/15311 , H01L2924/15312 , H01L2924/15313 , H01L2924/15787 , H01L2924/1579 , H01L2924/16195 , H01L2924/163 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/3511
摘要： An electronic package includes a carrier and a semiconductor chip. In a first aspect an interleaved seal band includes a pattern of a first type of seal band material and a second type of seal band material.
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公开(公告)号：US20170170086A1
公开(公告)日：2017-06-15
申请号：US14964281
申请日：2015-12-09
CPC分类号： H01L23/10 , H01L21/50 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/73 , H01L24/83 , H01L24/92 , H01L2224/131 , H01L2224/16227 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2224/81815 , H01L2224/83191 , H01L2224/83192 , H01L2224/92125 , H01L2224/92225 , H01L2924/15311 , H01L2924/15312 , H01L2924/15313 , H01L2924/15787 , H01L2924/1579 , H01L2924/16195 , H01L2924/163 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/3511
摘要： An electronic package includes a carrier and a semiconductor chip. In a first aspect a lid is attached to the chip and subsequently the gap between the lid and the carrier is filled by a seal band that includes seal band material and a plurality of shim members. In another aspect, an interleaved seal band includes a pattern of a first type of seal band material and a second type of seal band material. In another aspect, the lid includes a plurality of surfaces at different topographies to reduce the thickness of the seal band between the topographic lid and the carrier. In yet another aspect the electronic package further includes a frame concentric with the chip. The lid is attached to the frame with a solder, epoxy or elastomer and placed on the chip with a thermal interface material. The seal band material is dispensed on the chip carrier and the frame is then moved towards the chip carrier allowing a minimum seal band thickness.
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公开(公告)号：US09512291B2
公开(公告)日：2016-12-06
申请号：US14712125
申请日：2015-05-14
发明人： Theodorian Borca-Tasciuc , Sushumna Iruvanti , Fengyuan Lai , Kamyar Pashayi , Joel Plawsky , Hafez Raeisi-Fard
CPC分类号： C08K3/08 , B82Y30/00 , C08K2003/0806 , C08L63/00 , C09D139/06 , C09K5/063 , C09K5/14
摘要： A composite structure provides high thermal conductivity as a thermal interface structure with a relatively low filler loading. The composite structure is formed by dispersing nanoparticles in a matrix at a low filler loading, and controlled sintering of the composite structure to induce agglomeration of the nanoparticles into a connected percolating thermally conducting network structure within the matrix.
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公开(公告)号：US10804181B2
公开(公告)日：2020-10-13
申请号：US16299410
申请日：2019-03-12
IPC分类号： H01L23/373 , H01L23/367 , H01L23/00 , H01L21/48 , H01L23/31
摘要： Embodiments of the present invention relate to an heterogenous thermal interface material (TIM). The heterogenous TIM includes two or more different materials. One material has a low elastic modulus, also known as Young's modulus, and is utilized primarily to transfer heat from one component to another component. Another material has a higher elastic modulus and is primarily utilized to bond or connect the corners and/or edges of one component to the other component. The high elastic modulus material is generally located within the heterogenous TIM where TIM strain is or is expected to be high. For example, the high elastic modulus material may be located at the corner and/or edge regions of the heterogenous TIM.
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