Invention Grant
- Patent Title: Multi-purpose non-linear semiconductor package assembly line
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Application No.: US16720867Application Date: 2019-12-19
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Publication No.: US11302668B2Publication Date: 2022-04-12
- Inventor: Thorsten Meyer , Gerald Ofner , Stephan Bradl , Stefan Miethaner , Alexander Heinrich , Horst Theuss , Peter Scherl
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L21/677
- IPC: H01L21/677 ; H01L21/56 ; H01L21/67 ; H01L21/48 ; H01L21/78 ; H01L23/00 ; H01L23/495 ; H01L23/31
Abstract:
A method of producing packaged semiconductor devices includes providing a first packaging substrate panel, providing a second packaging substrate panel, and moving the first and second packaging substrate panels through an assembly line that comprises a plurality of package assembly tools using a control mechanism. First type packaged semiconductor devices are formed on the first packaging substrate panel and second type packaged semiconductor devices are formed on the second packaging substrate panel. The control mechanism moves both of the first and packaging substrate panels through the assembly line in a non-linear manner. The first and second packaged semiconductor devices differ with respect to at least one of: lead configuration, and encapsulant configuration.
Information query
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