Invention Grant
- Patent Title: Three-dimensional printing
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Application No.: US16491186Application Date: 2017-12-15
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Publication No.: US11304313B2Publication Date: 2022-04-12
- Inventor: Sterling Chaffins , Kevin P. Dekam , Thomas A. Saksa , Juan Sebastian Ramirez
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Spring
- Agency: HPI Patent Department
- International Application: PCT/US2017/066867 WO 20171215
- International Announcement: WO2019/117967 WO 20190620
- Main IPC: H05K3/46
- IPC: H05K3/46 ; B29C64/188 ; B29C64/165 ; H05K1/03 ; H05K3/12 ; B33Y10/00 ; B33Y70/00

Abstract:
According to examples, a method of making a three-dimensional conductive printed part, including forming a layer of polymeric build material; selectively applying a fusing agent on a first selected area of the formed polymeric build material; selectively applying a conductive agent on a second selected area of the formed polymeric build material; and applying a solder receiving material to a portion of the first selected area and a portion of the second selected area; in which the solder receiving material is present on a surface of the conductive three-dimensional printed part is disclosed.
Public/Granted literature
- US20210282276A1 THREE-DIMENSIONAL PRINTING Public/Granted day:2021-09-09
Information query