公开(公告)号：US12138860B2

公开(公告)日：2024-11-12

申请号：US17288550

申请日：2019-04-29

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Sterling Chaffins ,  Thomas A. Saksa ,  Kevin P. DeKam ,  Juan Sebastian Ramirez ,  Dale Peterson ,  Jami Ryan Barone

IPC: B29C64/295 ,  B22F1/054 ,  B22F1/10 ,  B29C64/165 ,  B29C64/268 ,  B33Y70/10 ,  B33Y10/00 ,  B33Y30/00

Abstract: Methods and systems for making three-dimensional printed articles. In one example, a method of making a three-dimensional article can include printing a conductive element including a composite of a conductive material and a polymeric build material; printing an adjacent portion in contact with the conductive element, where the adjacent portion includes a nonconductive polymeric build material; and heating the conductive element by running an electric current through the conductive element, and thereby heating the adjacent portion to a temperature sufficient to change a physical property of the nonconductive polymeric build material of the adjacent portion.

公开(公告)号：US20220063189A1

公开(公告)日：2022-03-03

申请号：US17288550

申请日：2019-04-29

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Sterling Chaffins ,  Thomas A. Saksa ,  Kevin P. DeKam ,  Juan Sebastian Ramirez ,  Dale Peterson ,  Jami Ryan Barone

IPC: B29C64/165 ,  B29C64/295 ,  B29C64/268

Abstract: Methods and systems for making three-dimensional printed articles. In one example, a method of making a three-dimensional article can include printing a conductive element including a composite of a conductive material and a polymeric build material; printing an adjacent portion in contact with the conductive element, where the adjacent portion includes a nonconductive polymeric build material; and heating the conductive element by running an electric current through the conductive element, and thereby heating the adjacent portion to a temperature sufficient to change a physical property of the nonconductive polymeric build material of the adjacent portion.

公开(公告)号：US20210282276A1

公开(公告)日：2021-09-09

申请号：US16491186

申请日：2017-12-15

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Sterling Chaffins ,  Kevin P. Dekam ,  Thomas A. Saksa ,  Juan Sebastian Ramirez

IPC: H05K3/46 ,  B29C64/188 ,  B29C64/165 ,  H05K3/12 ,  H05K1/03

Abstract: According to examples, a method of making a three-dimensional conductive printed part, including forming a layer of polymeric build material; selectively applying a fusing agent on a first selected area of the formed polymeric build material; selectively applying a conductive agent on a second selected area of the formed polymeric build material; and applying a solder receiving material to a portion of the first selected area and a portion of the second selected area; in which the solder receiving material is present on a surface of the conductive three-dimensional printed part is disclosed.

公开(公告)号：US20250058519A1

公开(公告)日：2025-02-20

申请号：US18938212

申请日：2024-11-05

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Sterling Chaffins ,  Thomas A. Saksa ,  Kevin P. DeKam ,  Juan Sebastian Ramirez ,  Dale Peterson ,  Jami Ryan Barone

IPC: B29C64/295 ,  B22F1/054 ,  B22F1/10 ,  B29C64/165 ,  B29C64/268 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/10

Abstract: Methods and systems for making three-dimensional printed articles. In one example, a method of making a three-dimensional article can include printing a conductive element including a composite of a conductive material and a polymeric build material; printing an adjacent portion in contact with the conductive element, where the adjacent portion includes a nonconductive polymeric build material; and heating the conductive element by running an electric current through the conductive element, and thereby heating the adjacent portion to a temperature sufficient to change a physical property of the nonconductive polymeric build material of the adjacent portion.

公开(公告)号：US11304313B2

公开(公告)日：2022-04-12

申请号：US16491186

申请日：2017-12-15

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Sterling Chaffins ,  Kevin P. Dekam ,  Thomas A. Saksa ,  Juan Sebastian Ramirez

IPC: H05K3/46 ,  B29C64/188 ,  B29C64/165 ,  H05K1/03 ,  H05K3/12 ,  B33Y10/00 ,  B33Y70/00

Abstract: According to examples, a method of making a three-dimensional conductive printed part, including forming a layer of polymeric build material; selectively applying a fusing agent on a first selected area of the formed polymeric build material; selectively applying a conductive agent on a second selected area of the formed polymeric build material; and applying a solder receiving material to a portion of the first selected area and a portion of the second selected area; in which the solder receiving material is present on a surface of the conductive three-dimensional printed part is disclosed.