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公开(公告)号：US11304313B2
公开(公告)日：2022-04-12
申请号：US16491186
申请日：2017-12-15
IPC分类号： H05K3/46 , B29C64/188 , B29C64/165 , H05K1/03 , H05K3/12 , B33Y10/00 , B33Y70/00
摘要： According to examples, a method of making a three-dimensional conductive printed part, including forming a layer of polymeric build material; selectively applying a fusing agent on a first selected area of the formed polymeric build material; selectively applying a conductive agent on a second selected area of the formed polymeric build material; and applying a solder receiving material to a portion of the first selected area and a portion of the second selected area; in which the solder receiving material is present on a surface of the conductive three-dimensional printed part is disclosed.
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公开(公告)号：US20160332450A1
公开(公告)日：2016-11-17
申请号：US15111148
申请日：2014-01-29
CPC分类号： B41J2/175 , B29B11/06 , B41J2/1603 , B41J2/1623 , B41J2/1628 , B41J2/1629 , B41J2/1632 , B41J2/1637 , B41J2002/14362 , H01L2924/181 , H01L2924/186
摘要： A fluid directing assembly can comprise a molded support comprising a modified epoxy molded compound which includes epoxy resin, cross-linker, filler, and is devoid of wax release agent. The assembly can also include a silicon die attached to the molded support and wherein the silicon die and the molded support define a fluid directing channel.
摘要翻译： 流体引导组件可以包括模制支撑体，其包含改性环氧模塑化合物，其包括环氧树脂，交联剂，填料，并且不含脱蜡剂。 组件还可以包括附接到模制支撑件的硅模具，并且其中硅模具和模制支撑件限定流体引导通道。
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公开(公告)号：US11312877B2
公开(公告)日：2022-04-26
申请号：US16074279
申请日：2016-10-25
发明人： Sterling Chaffins , Kevin P. Dekam
IPC分类号： C09D11/52 , C09D11/54 , B33Y10/00 , B29C64/165 , B33Y70/10 , C09D11/037 , C09D11/10 , C09D11/322 , C09D11/38 , C09D11/40 , B29K101/12 , B29K105/00 , B29K505/08
摘要： The present disclosure is drawn to fluid sets, material sets, and 3-dimensional printing systems. A fluid set can include a pretreat composition that includes a salt of an alkali metal with bromide or iodide. The fluid set can also include a conductive fusing agent composition including a transition metal for fusing thermoplastic powder when exposed to electromagnetic radiation.
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公开(公告)号：US20210282276A1
公开(公告)日：2021-09-09
申请号：US16491186
申请日：2017-12-15
IPC分类号： H05K3/46 , B29C64/188 , B29C64/165 , H05K3/12 , H05K1/03
摘要： According to examples, a method of making a three-dimensional conductive printed part, including forming a layer of polymeric build material; selectively applying a fusing agent on a first selected area of the formed polymeric build material; selectively applying a conductive agent on a second selected area of the formed polymeric build material; and applying a solder receiving material to a portion of the first selected area and a portion of the second selected area; in which the solder receiving material is present on a surface of the conductive three-dimensional printed part is disclosed.
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