A cantilever contact probe includes a shaped probe body included between a descending probe section and an ascending probe section. At least one end portion is formed in the descending probe section, and bent with respect to a longitudinal axis starting from a bending point and ending with a contact tip of the cantilever contact probe that is configured to abut onto a contact pad of a device under test of that wafer. Suitably, the shaped probe body comprises at least one base portion, an upper portion extending, starting from the base portion, along a longitudinal extension axis of the shaped probe body, orthogonally to the reference plane and a top portion, connected to the upper portion and having a greater diameter than a diameter of the upper portion to form a T, the upper portion being the stem of the T and the top portion being the crosspiece of the T.