- 专利标题: Semiconductor device, and associated method and system
-
申请号: US16849985申请日: 2020-04-15
-
公开(公告)号: US11309247B2公开(公告)日: 2022-04-19
- 发明人: Shih-Wei Peng , Wei-Cheng Lin , Jiann-Tyng Tzeng
- 申请人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- 申请人地址: TW Hsinchu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- 当前专利权人地址: TW Hsinchu
- 代理机构: WPAT, P.C., Intellectual Property Attorneys
- 代理商 Anthony King
- 主分类号: H01L23/528
- IPC分类号: H01L23/528 ; H01L21/8234 ; H01L23/522 ; H01L27/088
摘要:
A semiconductor device, including: a substrate, a transistor layer, a dielectric layer, and a power grid structure. The transistor layer is formed on a first side of the substrate and includes a plurality of active regions for forming transistors. The dielectric layer is formed on the transistor layer and includes a conductive strip disposed on a first active region and extending toward a second active region for signal connection. The power grid structure is formed on a second side of the substrate opposite to the first side and arranged to direct a power source to the transistor layer.
公开/授权文献
- US20210134720A1 SEMICONDUCTOR DEVICE, AND ASSOCIATED METHOD AND SYSTEM 公开/授权日:2021-05-06
信息查询
IPC分类: