- 专利标题： Photosensitive module
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申请号： US16851765申请日： 2020-04-17
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公开(公告)号： US11309443B2公开(公告)日： 2022-04-19
- 发明人: Chen-Er Hsu , Sin-Jhong Song , Chi-Fu Wu , Hao-Yu Wu , Tsutomu Fukai , Ming-Hung Wu
- 申请人： TDK TAIWAN CORP.
- 申请人地址： TW Taoyuan
- 专利权人： TDK TAIWAN CORP.
- 当前专利权人： TDK TAIWAN CORP.
- 当前专利权人地址： TW Taoyuan
- 代理机构： incy, Geissler, Olds & Lowe, P.C.
- 主分类号： H01L27/14
- IPC分类号： H01L27/14 ; H01L31/0232 ; H01L31/113 ; H01L31/0236 ; H01L31/02 ; H01L27/146 ; H01L31/0224 ; H01L31/024 ; G03B5/00 ; H04N5/225 ; G03B5/02 ; G03B5/04 ; G02B7/182 ; H02K11/21 ; G02B7/09 ; G02B27/64 ; G03B13/36 ; H02K41/035 ; G02B7/00 ; H01L23/00 ; G02B13/00
摘要：
A photosensitive module is provided. The photosensitive module includes a base, an integrated package substrate, and a photosensitive element. The integrated package substrate is connected to the base. The integrated package substrate has a plurality of first electronic components, and the first electronic components are housed inside the integrated package substrate without being exposed to external environment. The photosensitive element is connected to the integrated package substrate, and the photosensitive element is configured to receive a light beam traveling along an optical axis.
公开/授权文献
- US20200335644A1 PHOTOSENSITIVE MODULE 公开/授权日：2020-10-22
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