公开(公告)号：US11309443B2

公开(公告)日：2022-04-19

申请号：US16851765

申请日：2020-04-17

申请人： TDK TAIWAN CORP.

发明人： Chen-Er Hsu ,  Sin-Jhong Song ,  Chi-Fu Wu ,  Hao-Yu Wu ,  Tsutomu Fukai ,  Ming-Hung Wu

IPC分类号： H01L27/14 ,  H01L31/0232 ,  H01L31/113 ,  H01L31/0236 ,  H01L31/02 ,  H01L27/146 ,  H01L31/0224 ,  H01L31/024 ,  G03B5/00 ,  H04N5/225 ,  G03B5/02 ,  G03B5/04 ,  G02B7/182 ,  H02K11/21 ,  G02B7/09 ,  G02B27/64 ,  G03B13/36 ,  H02K41/035 ,  G02B7/00 ,  H01L23/00 ,  G02B13/00

摘要： A photosensitive module is provided. The photosensitive module includes a base, an integrated package substrate, and a photosensitive element. The integrated package substrate is connected to the base. The integrated package substrate has a plurality of first electronic components, and the first electronic components are housed inside the integrated package substrate without being exposed to external environment. The photosensitive element is connected to the integrated package substrate, and the photosensitive element is configured to receive a light beam traveling along an optical axis.