Invention Grant
- Patent Title: Memory devices and methods of forming the same
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Application No.: US16785673Application Date: 2020-02-10
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Publication No.: US11309490B2Publication Date: 2022-04-19
- Inventor: Chao-I Wu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H01L45/00
- IPC: H01L45/00 ; H01L27/24

Abstract:
Memory devices and methods of forming the same are provided. A memory device includes a substrate, a first conductive layer, a phase change layer, a selector layer and a second conductive layer. The first conductive layer is disposed over the substrate. The phase change layer is disposed over the first conductive layer. The selector layer is disposed between the phase change layer and the first conductive layer. The second conductive layer is disposed over the phase change layer. In some embodiments, at least one of the phase change layer and the selector layer has a narrow-middle profile.
Public/Granted literature
- US20210249597A1 MEMORY DEVICES AND METHODS OF FORMING THE SAME Public/Granted day:2021-08-12
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