Invention Grant
- Patent Title: Impinging jet manifold for chip cooling near edge jets
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Application No.: US16887122Application Date: 2020-05-29
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Publication No.: US11310937B2Publication Date: 2022-04-19
- Inventor: Jeremy Rice , Jeffrey Scott Spaulding , Evan Fraisse
- Applicant: Google LLC
- Applicant Address: US CA Mountain View
- Assignee: Google LLC
- Current Assignee: Google LLC
- Current Assignee Address: US CA Mountain View
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Agent Joseph K. Venier
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
Systems and methods for chip cooling with near edge jets in a direct liquid cooled module are disclosed. One of the functions of a direct liquid cooled module is to provide cooling liquid to components located on a chip. Jet impingement directly onto the back side of a chip is one cooling method that can provide more efficient cooling. An orifice plate includes an array of small diameter holes that correspond to high velocity jet locations and large diameter holes for the insertion of tubes to connect to lower pressure cavities.
Public/Granted literature
- US20210378139A1 Impinging Jet Manifold For Chip Cooling Near Edge Jets Public/Granted day:2021-12-02
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