公开(公告)号：US20210378139A1

公开(公告)日：2021-12-02

申请号：US16887122

申请日：2020-05-29

Applicant: Google LLC

Inventor： Jeremy Rice ,  Jeffrey Scott Spaulding ,  Evan Fraisse

IPC: H05K7/20

Abstract: Systems and methods for chip cooling with near edge jets in a direct liquid cooled module are disclosed. One of the functions of a direct liquid cooled module is to provide cooling liquid to components located on a chip. Jet impingement directly onto the back side of a chip is one cooling method that can provide more efficient cooling. An orifice plate includes an array of small diameter holes that correspond to high velocity jet locations and large diameter holes for the insertion of tubes to connect to lower pressure cavities.

公开(公告)号：US11310937B2

公开(公告)日：2022-04-19

申请号：US16887122

申请日：2020-05-29

Applicant: Google LLC

Inventor： Jeremy Rice ,  Jeffrey Scott Spaulding ,  Evan Fraisse

IPC: H05K7/20

Abstract: Systems and methods for chip cooling with near edge jets in a direct liquid cooled module are disclosed. One of the functions of a direct liquid cooled module is to provide cooling liquid to components located on a chip. Jet impingement directly onto the back side of a chip is one cooling method that can provide more efficient cooling. An orifice plate includes an array of small diameter holes that correspond to high velocity jet locations and large diameter holes for the insertion of tubes to connect to lower pressure cavities.