公开(公告)号：US11310937B2

公开(公告)日：2022-04-19

申请号：US16887122

申请日：2020-05-29

Applicant: Google LLC

Inventor： Jeremy Rice ,  Jeffrey Scott Spaulding ,  Evan Fraisse

IPC: H05K7/20

Abstract: Systems and methods for chip cooling with near edge jets in a direct liquid cooled module are disclosed. One of the functions of a direct liquid cooled module is to provide cooling liquid to components located on a chip. Jet impingement directly onto the back side of a chip is one cooling method that can provide more efficient cooling. An orifice plate includes an array of small diameter holes that correspond to high velocity jet locations and large diameter holes for the insertion of tubes to connect to lower pressure cavities.

公开(公告)号：US20180135917A1

公开(公告)日：2018-05-17

申请号：US15868584

申请日：2018-01-11

Applicant: Google LLC

Inventor： Jeremy Rice ,  Jeffrey S. Spaulding ,  Huan D. Nguyen

IPC: F28D15/02 ,  H05K7/20 ,  H01L23/40 ,  B23P15/26 ,  F28F1/40 ,  H01L23/367 ,  H01L23/427 ,  F28F13/00

CPC classification number: F28D15/0266 ,  B23P15/26 ,  F28D15/0275 ,  F28F1/40 ,  F28F2013/006 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/4006 ,  H01L23/427 ,  H01L2023/4081 ,  H01L2023/4087 ,  H01L2924/0002 ,  H05K7/20809 ,  Y10T29/49393 ,  H01L2924/00

Abstract: A thermosiphon system includes a condenser, an evaporator, and a condensate line fluidically coupling the condenser to the evaporator. The condensate line can be a tube with parallel passages can be used to carry the liquid condensate from the condenser to the evaporator and to carry the vapor from the evaporator to the condenser. The evaporator can be integrated into the tube. The condenser can be constructed with an angled core. The entire assembly can be constructed using a single material, e.g., aluminum, and can be brazed together in a single brazing operation.

公开(公告)号：US09970713B2

公开(公告)日：2018-05-15

申请号：US14967022

申请日：2015-12-11

Applicant: Google LLC

Inventor： Jeremy Rice ,  Jeffrey S. Spaulding ,  Huan D. Nguyen

IPC: F28D15/00 ,  H05K7/20 ,  F28D15/02 ,  H01L23/40 ,  H01L23/427 ,  F28F1/40 ,  B23P15/26 ,  H01L23/367 ,  F28F13/00

CPC classification number: F28D15/0266 ,  B23P15/26 ,  F28D15/0275 ,  F28F1/40 ,  F28F2013/006 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/4006 ,  H01L23/427 ,  H01L2023/4081 ,  H01L2023/4087 ,  H01L2924/0002 ,  H05K7/20809 ,  Y10T29/49393 ,  H01L2924/00

Abstract: A thermosiphon system includes a condenser, an evaporator, and a condensate line fluidically coupling the condenser to the evaporator. The condensate line can be a tube with parallel passages can be used to carry the liquid condensate from the condenser to the evaporator and to carry the vapor from the evaporator to the condenser. The evaporator can be integrated into the tube. The condenser can be constructed with an angled core. The entire assembly can be constructed using a single material, e.g., aluminum, and can be brazed together in a single brazing operation.

公开(公告)号：US20240386158A1

公开(公告)日：2024-11-21

申请号：US18198559

申请日：2023-05-17

Applicant: Google LLC

Inventor： Vasileios Kontorinis ,  Wenjie Dong ,  Eehern Wong ,  Jeffrey Ewin ,  Amanda Rose Gunckle ,  Jeremy Rice ,  Ravi Patel ,  Kenneth Peter Wong

IPC: G06F30/20 ,  H05K7/20

Abstract: The present disclosure relates to the estimating of data cooling specific to the individual location of the data centers by re-rating the performance rating of the modular cooling units. By analyzing data center specific metrics, the performance of the modular cooling units may be adjusted to account for changes in weather conditions, fan coil performance, hydraulic capacity, cold aisle temperatures, etc. All data may be provided to the user to allow for more efficient data cooling, predictions based on weather changes, and real time adjustments.

公开(公告)号：US20230397378A1

公开(公告)日：2023-12-07

申请号：US17829984

申请日：2022-06-01

Applicant: Google LLC

Inventor： Melanie Beauchemin ,  Madhusudan K. Iyengar ,  Reza H. Khiabani ,  Jeremy Rice ,  Jeffrey Ewin

IPC: H05K7/20

CPC classification number: H05K7/20836 ,  H05K7/20263 ,  H05K7/20272 ,  H05K7/20718

Abstract: A data center thermal control system includes a local cooler configured to cool a local coolant used for cooling electronic hardware, an outer heat exchanger configured to exchange heat from fluid to outside air, and a fluid circulation system configured to convey heat from the local cooler to the outer heat exchanger by circulating at least one fluid cooling medium, the fluid circulation system including a cold portion directed to the air cooler. The thermal control system also includes one or more processors and a non-transitory computer-readable medium storing instructions that, when executed by the one or more processors, would cause the one or more processors to govern the outer heat exchanger to cool fluid in the cold portion to a first target temperature during a hot season, and cool fluid in the cold portion to a lower target temperature during a cold season.

公开(公告)号：US20210378139A1

公开(公告)日：2021-12-02

申请号：US16887122

申请日：2020-05-29

Applicant: Google LLC

Inventor： Jeremy Rice ,  Jeffrey Scott Spaulding ,  Evan Fraisse

IPC: H05K7/20

Abstract: Systems and methods for chip cooling with near edge jets in a direct liquid cooled module are disclosed. One of the functions of a direct liquid cooled module is to provide cooling liquid to components located on a chip. Jet impingement directly onto the back side of a chip is one cooling method that can provide more efficient cooling. An orifice plate includes an array of small diameter holes that correspond to high velocity jet locations and large diameter holes for the insertion of tubes to connect to lower pressure cavities.

公开(公告)号：US10016860B2

公开(公告)日：2018-07-10

申请号：US15264199

申请日：2016-09-13

Applicant: Google LLC

Inventor： Jeremy Rice ,  Huan D. Nguyen ,  Jeffrey S. Spaulding

IPC: B23P15/26 ,  F28D15/02 ,  H01L23/427 ,  H01L23/467 ,  H01L23/40

CPC classification number: B23P15/26 ,  F28D15/0233 ,  F28D15/0266 ,  F28D15/0275 ,  F28F2275/04 ,  H01L23/40 ,  H01L23/4006 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  Y10T29/49364 ,  H01L2924/00

Abstract: A method of assembling a thermosiphon system includes placing a base of an evaporator and a tube of a condensate line in a brazing fixture such that the base covers an aperture in a bottom of the tube with a bottom surface of the base abutting a precision machined surface of the brazing fixture, and simultaneously brazing the base and the tube while held by the brazing fixture to form a unitary body in a single brazing process, the unitary body including the evaporator and the condensate line.

公开(公告)号：US10225959B2

公开(公告)日：2019-03-05

申请号：US15341190

申请日：2016-11-02

Applicant: Google LLC

Inventor： Jeremy Rice ,  Bill Dailey ,  Jeffrey S. Spaulding

IPC: F28D15/02 ,  H05K7/20 ,  F25B21/02 ,  G06F1/20 ,  F28D15/04 ,  H01L23/427

Abstract: A thermosiphon system includes a condenser and an evaporator fluidly coupled to the condenser by a condensate line. The evaporator includes a housing having an opening to the condensate line, a wick located in the housing, and a flow restrictor located in the housing configured to restrict flow of a working fluid from the condensate line onto a portion of the wick.