Invention Grant
- Patent Title: Metal-connected particle articles
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Application No.: US15764871Application Date: 2016-01-29
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Publication No.: US11311942B2Publication Date: 2022-04-26
- Inventor: Kristopher J Erickson , Krzysztof Nauka , Thomas Anthony , Lihua Zhao , Howard S Tom
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: HPI Patent Department
- International Application: PCT/US2016/015723 WO 20160129
- International Announcement: WO2017/131760 WO 20170803
- Main IPC: B22F10/10
- IPC: B22F10/10 ; B33Y10/00 ; C23C18/30 ; C23C24/08 ; C23C24/10 ; B82B1/00 ; B82B3/00 ; C23C18/08
Abstract:
Apparatus and methods for making metal-connected particle articles. A metal containing fluid is selectively applied to a layer of particles. The metal in the fluid is used to form metal connections between particles. The metal connections are formed at temperatures below the sintering temperature of the particles in the layer of particles.
Public/Granted literature
- US20180272427A1 METAL-CONNECTED PARTICLE ARTICLES Public/Granted day:2018-09-27
Information query
