Invention Grant
- Patent Title: Polymerizable compound, polymerizable composition, polymer, and photoresist composition
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Application No.: US16968874Application Date: 2019-02-13
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Publication No.: US11312804B2Publication Date: 2022-04-26
- Inventor: Koichi Shibata , Teizi Satou , Daisuke Inoki , Hideki Hayashi
- Applicant: JNC CORPORATION
- Applicant Address: JP Tokyo
- Assignee: JNC CORPORATION
- Current Assignee: JNC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: JCIPRNET
- Priority: JPJP2018-025633 20180216
- International Application: PCT/JP2019/005076 WO 20190213
- International Announcement: WO2019/159957 WO 20190822
- Main IPC: C07D309/30
- IPC: C07D309/30 ; C08F220/28 ; G03F7/004
Abstract:
A polymerizable compound represented by formula (1). In formula (1), one of eight hydrogen atoms is substituted by a (meth)acryloyloxy group, and the rest seven hydrogen atoms are independently non-substituted or substituted by a saturated hydrocarbon group having 1 to 10 carbons.
Public/Granted literature
- US20210009546A1 POLYMERIZABLE COMPOUND, POLYMERIZABLE COMPOSITION, POLYMER, AND PHOTORESIST COMPOSITION Public/Granted day:2021-01-14
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