Invention Grant
- Patent Title: Resin composition, prepreg, film including resin, metal foil including resin, metal-clad laminate, and wiring board
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Application No.: US16629829Application Date: 2018-06-22
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Publication No.: US11312858B2Publication Date: 2022-04-26
- Inventor: Tatsuya Arisawa , Fumito Suzuki , Shunji Araki , Hirohisa Goto , Yuki Inoue
- Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JPJP2017-135895 20170712
- International Application: PCT/JP2018/023811 WO 20180622
- International Announcement: WO2019/012954 WO 20190117
- Main IPC: C08L71/12
- IPC: C08L71/12 ; B32B15/08 ; C08J5/04 ; C08J5/18 ; C08J5/24 ; C08K3/36 ; C08K5/00 ; C08K5/3492 ; C08K5/5399 ; C08K5/544

Abstract:
Provided is a resin composition containing: a modified polyphenylene ether compound terminally modified with a substituent having an unsaturated carbon-carbon double bond; a cross-linking curing agent having an unsaturated carbon-carbon double bond in its molecule; a silane coupling agent having a phenylamino group in its molecule; and silica. A content of the silica is 60 to 250 parts by mass with respect to a total of 100 parts by mass of the modified polyphenylene ether compound and the cross-linking curing agent.
Public/Granted literature
Information query
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