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公开(公告)号：US11312858B2
公开(公告)日：2022-04-26
申请号：US16629829
申请日：2018-06-22
发明人： Tatsuya Arisawa , Fumito Suzuki , Shunji Araki , Hirohisa Goto , Yuki Inoue
IPC分类号： C08L71/12 , B32B15/08 , C08J5/04 , C08J5/18 , C08J5/24 , C08K3/36 , C08K5/00 , C08K5/3492 , C08K5/5399 , C08K5/544
摘要： Provided is a resin composition containing: a modified polyphenylene ether compound terminally modified with a substituent having an unsaturated carbon-carbon double bond; a cross-linking curing agent having an unsaturated carbon-carbon double bond in its molecule; a silane coupling agent having a phenylamino group in its molecule; and silica. A content of the silica is 60 to 250 parts by mass with respect to a total of 100 parts by mass of the modified polyphenylene ether compound and the cross-linking curing agent.
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公开(公告)号：US20180297329A1
公开(公告)日：2018-10-18
申请号：US16015222
申请日：2018-06-22
发明人： Yuki Kitai , Akira Irifune , Yuki Inoue , Yuki Tokuda
摘要： A metal-clad laminate includes an insulating layer including a cured product of a resin composition, and a metal foil disposed on a principal surface of the insulating layer. The resin composition includes a polyphenylene ether copolymer and a thermosetting curing agent, the polyphenylene ether copolymer having an intrinsic viscosity measured in methylene chloride at 25° C. of between 0.03 dl/g and 0.12 dl/g, inclusive. And the polyphenylene ether copolymer has, at a molecular terminal, a group represented by formula (1) or formula (2) at an average number of 1.5 to 3 per one molecule. Further, the metal foil has a first surface that is in contact with the insulating layer, the first surface having a 10-point average roughness (Rz) of 2.0 μm or less. And the metal foil includes a barrier layer disposed at a side of the first surface, the barrier layer containing cobalt.
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公开(公告)号：US11895770B2
公开(公告)日：2024-02-06
申请号：US17281845
申请日：2019-09-27
发明人： Yuki Inoue , Tatsuya Arisawa , Shun Yamaguchi
IPC分类号： H05K1/05 , G01N23/2273 , H05K1/09 , B32B15/08 , H05K3/00
CPC分类号： H05K1/056 , B32B15/08 , G01N23/2273 , H05K1/09 , H05K3/002 , H05K2201/0166 , H05K2201/0355
摘要： A copper-clad laminate includes an insulating layer and a copper foil in contact with at least one surface of the insulating layer, in which the insulating layer contains a cured product of a resin composition containing a modified polyphenylene ether compound of which a terminal is modified with a substituent having a carbon-carbon unsaturated double bond, a chromium element amount on an exposed surface on which the insulating layer is exposed by an etching treatment of the copper-clad laminate with a copper chloride solution, measured by X-ray photoelectron spectroscopy is 7.5 at % or less with respect to a total element amount measured by X-ray photoelectron spectroscopy, and a surface roughness of the exposed surface is 2.0 μm or less in terms of ten-point average roughness.
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公开(公告)号：US11254100B2
公开(公告)日：2022-02-22
申请号：US16015222
申请日：2018-06-22
发明人： Yuki Kitai , Akira Irifune , Yuki Inoue , Yuki Tokuda
摘要： A metal-clad laminate includes an insulating layer including a cured product of a resin composition, and a metal foil disposed on a principal surface of the insulating layer. The resin composition includes a polyphenylene ether copolymer and a thermosetting curing agent, the polyphenylene ether copolymer having an intrinsic viscosity measured in methylene chloride at 25° C. of between 0.03 dl/g and 0.12 dl/g, inclusive. And the polyphenylene ether copolymer has, at a molecular terminal, a group represented by formula (1) or formula (2) at an average number of 1.5 to 3 per one molecule. Further, the metal foil has a first surface that is in contact with the insulating layer, the first surface having a 10-point average roughness (Rz) of 2.0 μm or less. And the metal foil includes a barrier layer disposed at a side of the first surface, the barrier layer containing cobalt.
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公开(公告)号：US12109779B2
公开(公告)日：2024-10-08
申请号：US17768170
申请日：2020-10-15
发明人： Yuki Inoue , Tatsuya Arisawa , Yuki Kitai
IPC分类号： B32B15/20 , B32B15/082
CPC分类号： B32B15/20 , B32B15/082
摘要： A copper-clad laminate includes an insulating layer that contains a cured product of a resin composition containing a polymer having a structural unit represented by the following Formula (1) in a molecule, and a metal foil that is laminated on the insulating layer, and in which a chromium element amount, on an exposed surface of the insulating layer exposed by an etching treatment of the copper-clad laminate is 7.5 at % or less with respect to a total element amount on the exposed surface, and ten-point average roughness of the exposed surface is 2.0 μm or less.
In Formula (1), Z represents an arylene group, R1 to R3 each independently represent a hydrogen atom or an alkyl group, and R4 to R6 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.-
公开(公告)号：US11267225B2
公开(公告)日：2022-03-08
申请号：US16071071
申请日：2016-12-12
发明人： Tatsuya Arisawa , Tomoyuki Abe , Shunji Araki , Yuki Inoue
IPC分类号： B32B15/092 , B32B37/18 , H05K1/03 , H05K1/09 , B32B15/08
摘要： A metal-clad laminated board includes an insulating layer and a metal layer in contact with at least one surface of the insulating layer. The insulating layer includes a cured product of a thermosetting resin composition containing a reaction product of a polyphenylene ether and an epoxy compound. The polyphenylene ether has 1.5 to 2 hydroxyl groups on average in one molecule, and the epoxy compound has 2 to 2.3 epoxy groups on average in one molecule. In the metal-clad laminated board, the reaction product has a terminal hydroxyl group concentration of 700 μmol/g or less. The metal layer includes a metal substrate and a barrier layer containing cobalt. The barrier layer is provided on the metal substrate at a side close to a contact surface of the metal layer with the insulating layer. The contact surface has surface roughness of 2 μm or less in ten-point average roughness Rz.
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公开(公告)号：US10820413B2
公开(公告)日：2020-10-27
申请号：US16069687
申请日：2017-01-16
发明人： Yuki Inoue , Tatsuya Arisawa , Yuki Kitai
IPC分类号： C08L63/00 , C08L71/12 , B32B15/08 , H05K1/03 , B32B27/18 , C09D163/00 , H05K3/38 , C08G59/68 , H05K1/09 , C08G59/22 , C08G59/24 , C08G59/40 , C08J5/24 , H05K1/02 , H05K3/02 , H05K3/00
摘要： The metal-clad laminate includes an insulating layer and a metal layer that exists in contact with at least one surface of this insulating layer. The insulating layer includes a cured product of a thermosetting resin composition that contains an epoxy compound having a number-average molecular weight of 1000 or less and at least two epoxy groups per molecule, a polyphenylene ether, a cyanate ester compound, a curing catalyst, and a halogen-based flame retardant. The halogen-based flame retardant is a flame retardant incompatible and dispersed in the thermosetting resin composition. The metal layer includes a metal substrate and a cobalt-containing barrier layer provided on at least a contact surface side of this metal substrate with the insulating layer. In the metal-clad laminate, the contact surface has, as surface roughness, a ten-point average roughness Rz of 2 μm or less.
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