Invention Grant
- Patent Title: Semiconductor device and method of fabricating the same
-
Application No.: US17022233Application Date: 2020-09-16
-
Publication No.: US11314919B2Publication Date: 2022-04-26
- Inventor: Yongdeok Kim , Munjun Seo , Bonghyun Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2019-0159600 20191204,KR10-2020-0072141 20200615
- Main IPC: G06F30/30
- IPC: G06F30/30 ; G06F30/3953 ; G03F1/36 ; G06F30/398 ; G06F30/392

Abstract:
Disclosed are a semiconductor device and a method of fabricating the same. The semiconductor device includes an area-oriented region and a performance-oriented region, standard cells disposed on each of the area-oriented region and the performance-oriented region, and a routing metal layer on the standard cells. The routing metal layer includes first routing lines on the area-oriented region and second routing lines on the performance-oriented region. The smallest line width of the first routing lines is a first width, the smallest line width of the second routing lines is a second width greater than the first width, a pitch between the first routing lines is a first pitch, and a pitch between the second routing lines is a second pitch greater than the first pitch.
Public/Granted literature
- US20210174001A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2021-06-10
Information query