Invention Grant
- Patent Title: Semiconductor memory device including capacitor with shaped electrode and method for fabricating thereof
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Application No.: US17038606Application Date: 2020-09-30
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Publication No.: US11315929B2Publication Date: 2022-04-26
- Inventor: Seung Jae Jung , Jae Hoon Kim , Kwang-Ho Park , Yong-hoon Son
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2020-0018974 20200217
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H01L27/13 ; H01L25/18 ; H01L27/12

Abstract:
A semiconductor device includes a bit line extending in a first direction, a gate electrode extending in a second direction, and a semiconductor pattern extending in a third direction and connected to the bit line, and a capacitor. The capacitor includes a first electrode connected to the semiconductor pattern and a dielectric film between the first and second electrodes. The first or the second direction is perpendicular to an upper surface of the substrate. The first electrode includes an upper and a lower plate region parallel to the upper surface of the substrate, and a connecting region which connects the upper and the lower plate regions. The upper and the lower plate regions of the first electrode include an upper and a lower surface facing each other. The dielectric film extends along the upper and the lower surfaces of the upper and lower plate regions of the first electrode.
Public/Granted literature
- US20210257368A1 SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR FABRICATING THEREOF Public/Granted day:2021-08-19
Information query
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