Invention Grant
- Patent Title: Memory device and memory module including same
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Application No.: US17108331Application Date: 2020-12-01
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Publication No.: US11321177B2Publication Date: 2022-05-03
- Inventor: Minsu Kim , Nam Hyung Kim , Dae-Jeong Kim , Do-Han Kim , Deokho Seo , Wonjae Shin , Yongjun Yu , Changmin Lee , Insu Choi
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Volentine, Whitt & Francos, PLLC
- Priority: KR10-2020-0063542 20200527
- Main IPC: G06F11/10
- IPC: G06F11/10 ; G11C11/4091 ; G11C11/408

Abstract:
A memory device includes a peripheral circuit communicating with memory banks. Each of the banks includes a memory cell array including memory cells, a row decoder connected with the memory cells through word lines, bit line sense amplifiers connected with the memory cells through bit lines including first bit lines and second bit lines, and a column decoder configured to connect the bit line sense amplifiers with the peripheral circuit. The memory cell array includes a first section connected with the first bit lines and a second section connected with the second bit lines, and the first section and second section are independent of each other with regard to a row-dependent error.
Public/Granted literature
- US20210374001A1 MEMORY DEVICE AND MEMORY MODULE INCLUDING SAME Public/Granted day:2021-12-02
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