Invention Grant
- Patent Title: Colorless copper-containing material
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Application No.: US16718922Application Date: 2019-12-18
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Publication No.: US11326062B2Publication Date: 2022-05-10
- Inventor: Joydeep Lahiri , Jeffrey Glenn Lynn , Florence Christine Monique Verrier
- Applicant: CORNING INCORPORATED
- Applicant Address: US NY Corning
- Assignee: CORNING INCORPORATED
- Current Assignee: CORNING INCORPORATED
- Current Assignee Address: US NY Corning
- Main IPC: C09D5/14
- IPC: C09D5/14 ; C08K3/40 ; C08K5/36 ; C08K3/015 ; A01N59/20 ; C09D5/16 ; C03C4/02 ; C03C3/064 ; A01N59/24 ; C03C14/00 ; C09D7/61 ; C09D7/40 ; C08K3/22 ; C08K7/20

Abstract:
Aspects of this disclosure pertain to a colorless material that includes a carrier, copper-containing particles, and either one or both of sodium thiocyanate and titanium dioxide. In one or more embodiments, the material exhibits, in the CIE L*a*b* system, an L* value in the range from about 91 to about 100, and a C* value of less than about 7, wherein C* equals √(a*2+b*2). In some embodiments, the material exhibits a greater than 3 log reduction in a concentration of Staphylococcus aureus, under the EPA Test Method for Efficacy of Copper Alloy as a Sanitizer testing conditions.
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